Browsing by Subject "Aluminum nitride"

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Open Access
AlGaN/GaN HEMT-based fully monolithic X-band low noise amplifier
(Wiley, 2005-04) Schwindt, R.; Kumar, V.; Aktas, O.; Lee, J. W.; Adesida, I.
A fully monolithic AlGaN/GaN HEMT-based low noise amplifier is reported. The circuit demonstrated a noise figure of 3.5 dB, gain of -7.5 dB, input return loss of -7.5 dB, and output return loss of -15 dB at 8.5 GHz. The dc characteristics of individual 0.25-μm × 150-μm transistors were: maximum current density of 1.0 A/mm, maximum transconductance of 170 mS/mm and a threshold voltage of -6.8 V. The devices have a typical short circuit current gain cutoff frequency of 24.5 GHz and a maximum oscillating frequency of 48 GHz. The devices demonstrated a minimum noise figure of 1.6 dB with an associated gain of 10.6 dB at 10 GHz.
Open Access
Determination of energy-band offsets between GaN and AlN using excitonic luminescence transition in AlGaN alloys
(American Institute of Physics, 2006) Westmeyer, A. N.; Mahajan, S.; Bajaj, K. K.; Lin J. Y.; Jiang, H. X.; Koleske, D. D.; Senger, R. T.
We report the determination of the energy-band offsets between GaN and AlN using the linewidth (full width at half maximum) of an extremely sharp excitonic luminescence transition in Alx Ga1-x N alloy with x=0.18 at 10 K. Our sample was grown on C -plane sapphire substrate by metal-organic chemical-vapor deposition at 1050 °C. The observed value of the excitonic linewidth of 17 meV is the smallest ever reported in literature. On subtracting a typical value of the excitonic linewidth in high-quality GaN, namely, 4.0 meV, we obtain a value of 13.0 meV, which we attribute to compositional disorder. This value is considerably smaller than that calculated using a delocalized exciton model [S. M. Lee and K. K. Bajaj, J. Appl. Phys. 73, 1788 (1993)]. The excitons are known to be strongly localized by defects and/or the potential fluctuations in this alloy system. We have simulated this localization assuming that the hole, being much more massive than the electron, is completely immobile, i.e., the hole mass is treated as infinite. Assuming that the excitonic line broadening is caused entirely by the potential fluctuations experienced by the conduction electron, the value of the conduction-band offset between GaN and AlN is determined to be about 57% of the total-band-gap discontinuity. Using our model we have calculated the variation of the excitonic linewidth as a function of Al composition in our samples with higher Al content larger than 18% and have compared it with the experimental data. We also compare our value of the conduction-band offset with those recently proposed by several other groups using different techniques.
Open Access
Electrical conduction and dielectric relaxation properties of AlN thin films grown by hollow-cathode plasma-assisted atomic layer deposition
(Institute of Physics Publishing, 2016) Altuntas, H.; Bayrak, T.; Kizir, S.; Haider, A.; Bıyıklı, Necmi
In this study, aluminum nitride (AlN) thin films were deposited at 200 ï¿½C, on p-type silicon substrates utilizing a capacitively coupled hollow-cathode plasma source integrated atomic layer deposition (ALD) reactor. The structural properties of AlN were characterized by grazing incidence x-ray diffraction, by which we confirmed the hexagonal wurtzite single-phase crystalline structure. The films exhibited an optical band edge around ∼5.7 eV. The refractive index and extinction coefficient of the AlN films were measured via a spectroscopic ellipsometer. In addition, to investigate the electrical conduction mechanisms and dielectric properties, Al/AlN/p-Si metal-insulator-semiconductor capacitor structures were fabricated, and current density-voltage and frequency dependent (7 kHz-5 MHz) dielectric constant measurements (within the strong accumulation region) were performed. A peak of dielectric loss was observed at a frequency of 3 MHz and the Cole-Davidson empirical formula was used to determine the relaxation time. It was concluded that the native point defects such as nitrogen vacancies and DX centers formed with the involvement of Si atoms into the AlN layers might have influenced the electrical conduction and dielectric relaxation properties of the plasma-assisted ALD grown AlN films.
Open Access
Electron momentum and energy relaxation rates in GaN and AlN in the high-field transport regime
(The American Physical Society, 2003) Bulutay, C.; Ridley, B. K.; Zakhleniuk, N. A.
Momentum and energy relaxation characteristics of electrons in the conduction band of GaN and AlN are investigated using two different theoretical approaches corresponding to two high electric-field regimes, one up to 1-2 MV/ cm values for incoherent dynamics, and the other at even higher fields for coherent dynamics where semiballistic and ballistic processes become important. For the former, ensemble Monte Carlo technique is utilized to evaluate these rates as a function of electron energy up to an electric-field value of 1 MV/cm (2 MV/cm) for GaN (AlN). Momentum and energy relaxation rates within this incoherent transport regime in the presence of all standard scattering mechanisms are computed as well as the average drift velocity as a function of the applied field. Major scattering mechanisms are identified as polar optical phonon (POP) scattering and the optical deformation potential (ODP) scattering. Roughly, up to fields where the steady-state electron velocity attains its peak value, the POP mechanism dominates, whereas at higher fields ODP mechanism takes over. Next, aiming to characterize coherent dynamics, the total out-scattering rate from a quantum state (chosen along a high-symmetry direction) due to these two scattering mechanisms are then computed using a first-principles full-band approach. In the case of POP scattering, momentum relaxation rate differs from the total out-scattering rate from that state; close to the conduction-band minimum, momentum relaxation rate is significantly lower than the scattering rate because of forward-scattering character of the intravalley POP emission., However, close to the zone boundary the difference between these two rates diminishes due to isotropic nature of intervalley scatterings. Finally, a simple estimate for the velocity-field behavior in the coherent transport regime is attempted, displaying a negative differential mobility due to the negative band effective mass along the electric-field direction.
Open Access
Fundamentals, progress, and future directions of nitride-based semiconductors and their composites in two-dimensional limit: a first-principles perspective to recent synthesis
(American Institute of Physics Inc., 2018) Kecik D.; Onen, A.; Konuk, M.; Gürbüz, E.; Ersan, F.; Cahangirov, S.; Aktürk, E.; Durgun, Engin; Çıracı, Salim
Potential applications of bulk GaN and AlN crystals have made possible single and multilayer allotropes of these III-V compounds to be a focus of interest recently. As of 2005, the theoretical studies have predicted that GaN and AlN can form two-dimensional (2D) stable, single-layer (SL) structures being wide band gap semiconductors and showing electronic and optical properties different from those of their bulk parents. Research on these 2D structures have gained importance with recent experimental studies achieving the growth of ultrathin 2D GaN and AlN on substrates. It is expected that these two materials will open an active field of research like graphene, silicene, and transition metal dichalcogenides. This topical review aims at the evaluation of previous experimental and theoretical works until 2018 in order to provide input for further research attempts in this field. To this end, starting from three-dimensional (3D) GaN and AlN crystals, we review 2D SL and multilayer (ML) structures, which were predicted to be stable in free-standing states. These are planar hexagonal (or honeycomb), tetragonal, and square-octagon structures. First, we discuss earlier results on dynamical and thermal stability of these SL structures, as well as the predicted mechanical properties. Next, their electronic and optical properties with and without the effect of strain are reviewed and compared with those of the 3D parent crystals. The formation of multilayers, hence prediction of new periodic layered structures and also tuning their physical properties with the number of layers are other critical subjects that have been actively studied and discussed here. In particular, an extensive analysis pertaining to the nature of perpendicular interlayer bonds causing planar GaN and AlN to buckle is presented. In view of the fact that SL GaN and AlN can be fabricated only on a substrate, the question of how the properties of free-standing, SL structures are affected if they are grown on a substrate is addressed. We also examine recent works treating the composite structures of GaN and AlN joined commensurately along their zigzag and armchair edges and forming heterostructures, δ-doping, single, and multiple quantum wells, as well as core/shell structures. Finally, outlooks and possible new research directions are briefly discussed. © 2018 Author(s).
Open Access
High-energy electron relaxation and full-band electron dynamics in aluminium nitride
(Elsevier, 2002) Bulutay, Ceyhun; Ridley, B. K.; Zakhleniuk, N. A.
Material properties of AlN, particularly its wide band gap around 6 eV, warrant its operation in the high-field transport regimes reaching MV/cm fields. In this theoretical work, we examine the full-band scattering of conduction band electrons in AlN due to polar optical phonon (POP) emission, which is the main scattering channel at high fields. First, we obtain the band structure for the wurtzite phase of AlN using the empirical pseudopotential method. Scattering rates along the full length of several high-symmetry directions are computed efficiently through the Lehmann-Taut Brillouin zone integration technique. In order to shed light on the behaviour of the velocity-field characteristics at extremely high electric fields, in the order of a few MV/cm, we resort to an Esaki-Tsu estimation. Comparison of these results for AlN is made with our similar work on GaN. With typically more than 50% higher POP scattering rate compared to GaN, AlN has poorer high-field prospects. Availability of these data for AlN and GaN paves the way for practical assessment of the high-energy electron dynamics for the ternary alloy, AlGaN.
Open Access
High-performance solar-blind AlGaN photodetectors
(SPIE, 2005) Özbay, Ekmel; Tut, Turgut; Bıyıklı, N.
Design, fabrication, and characterization of high-performance Al xGa1-xN-based photodetectors for solar-blind applications are reported. AlxGa1-xN heterostructures were designed for Schottky, p-i-n, and metal-semiconductor-metal (MSM) photodiodes. The solar-blind photodiode samples were fabricated using a microwave compatible fabrication process. The resulting devices exhibited extremely low dark currents. Below 3 fA leakage currents at 6 V and 12 V reverse bias were measured on p-i-n and Schottky photodiode samples respectively. The excellent current-voltage (I-V) characteristics led to a detectivity performance of 4.9×1014 cmHz1/2W-1. The MSM devices exhibited photoconductive gain, while Schottky and p-i-n samples displayed 0.15 A/W and 0.11 A/W peak responsivity values at 267 nm and 261 nm respectively. All samples displayed true solar-blind response with cut-off wavelengths smaller than 280 nm. A visible rejection of 4×104 was achieved with Schottky detector samples. High speed measurements at 267 nm resulted in fast pulse responses with >GHz bandwidths. The fastest devices were MSM photodiodes with a maximum 3-dB bandwidth of 5.4 GHz.
Open Access
The influence of N2/H2 and ammonia N source materials on optical and structural properties of AlN films grown by plasma enhanced atomic layer deposition
(2011) Alevli, M.; Ozgit, C.; Donmez, I.; Bıyıklı, Necmi
The influence of N2/H2 and ammonia as N source materials on the properties of AlN films grown by plasma enhanced atomic layer deposition using trimethylaluminum as metal source has been studied. The -2Θ grazing-incidence X-ray diffraction, high resolution transmission electron microscopy, and spectroscopic ellipsometry results on AlN films grown using either NH3 or N2/H2 plasma revealed polycrystalline and wurtzite AlN layers. The AlN growth rate per cycle was decreased from 0.84 to 0.54 Å/cycle when the N source was changed from NH3 to N2/H2. Growth rate of AlN remained constant within 100200 °C for both N precursors, confirming the self-limiting growth mode in the ALD window. AlAl bond was detected only near the surface in the AlN film grown with NH3 plasma. AFM analysis showed that the RMS roughness values for AlN films grown on Si(100) substrates using NH3 and N2/H2 plasma sources were 1.33 nm and 1.18 nm, respectively. The refractive indices of both AlN films are similar except for a slight difference in the optical band edge and position of optical phonon modes. The optical band edges of the grown AlN films are observed at 5.83 and 5.92 eV for ammonia and N2/H2 plasma, respectively. According to the FTIR data for both AlN films on sapphire substrates, the E1(TO) phonon mode position shifted from 671 cm -1 to 675 cm-1 when the plasma source was changed from NH3 to N2/H2. © 2011 Elsevier B.V. All Rights Reserved.
Open Access
Low-temperature hollow cathode plasma-assisted atomic layer deposition of crystalline III-nitride thin films and nanostructures
(Wiley - V C H Verlag GmbH & Co. KGaA, 2015) Ozgit Akgun, C.; Goldenberg, E.; Bolat, S.; Tekcan, B.; Kayaci, F.; Uyar, Tamer; Okyay, Ali Kemal; Bıyıklı, Necmi
Hollow cathode plasma-assisted atomic layer deposition (HCPA-ALD) is a promising technique for obtaining III-nitride thin films with low impurity concentrations at low temperatures. Here we report our previous and current efforts on the development of HCPA-ALD processes for III-nitrides together with the properties of resulting thin films and nanostructures. The content further includes nylon 6,6-GaN core-shell nanofibers, proof-of-concept thin film transistors and UV photodetectors fabricated using HCPA-ALD-grown GaN layers, as well as InN thin films deposited by HCPA-ALD using cyclopentadienyl indium and trimethylindium precursors. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Open Access
On the hole accelerator for III-nitride light-emitting diodes
(American Institute of Physics Inc., 2016) Zhang Z.-H.; Zhang, Y.; Bi, W.; Geng, C.; Xu S.; Demir, Hilmi Volkan; Sun, X. W.
In this work, we systematically conduct parametric studies revealing the sensitivity of the hole injection on the hole accelerator (a hole accelerator is made of the polarization mismatched p-electron blocking layer (EBL)/p-GaN/p-AlxGa1-xN heterojunction) with different designs, including the AlN composition in the p-AlxGa1-xN layer, and the thickness for the p-GaN layer and the p-AlxGa1-xN layer. According to our findings, the energy that the holes obtain does not monotonically increase as the AlN incorporation in the p-AlxGa1-xN layer increases. Meanwhile, with p-GaN layer or p-AlxGa1-xN layer thickening, the energy that the holes gain increases and then reaches a saturation level. Thus, the hole injection efficiency and the device efficiency are very sensitive to the p-EBL/p-GaN/p-AlxGa1-xN design, and the hole accelerator can effectively increase the hole injection if properly designed.
Open Access
Plasma-enhanced atomic layer deposition of III-nitride thin films
(Electrochemical Society Inc., 2013) Ozgit-Akgun, Çağla; Dönmez İnci; Bıyıklı, Necmi
AlN and GaN thin films were deposited by plasma-enhanced atomic layer deposition using trimethylmetal precursors. The films were found to have high oxygen incorporation, which was attributed to oxygen contamination related to the plasma system. The choice of nitrogen containing plasma gas (N2, N2/H2 or NH3) determined the severity of oxygen incorporation into deposited films. Lowest oxygen concentrations were attained for AlN and GaN thin films using NH3 and N2 plasma, respectively. Initial experiments have shown that GaN thin films with low impurity concentrations can be deposited when plasma-related oxygen contamination is avoided by the use of an alternative plasma source. © The Electrochemical Society.
Open Access
Preparation of Al 2O 3and AlN nanotubes by atomic layer deposition
(Cambridge University Press, 2012) Ozgit-Akgun, Çagla; Kayacı, Fatma; Dönmez, İnci; Çağatay, Engin; Uyar, Tamer; Bıyıklı, Necmi
Al 2O 3 and AlN nanotubes were fabricated by depositing conformal thin films via atomic layer deposition (ALD) on electrospun nylon 66 (PA66) nanofiber templates. Depositions were carried out at 200°C, using trimethylaluminum (TMAl), water (H 2O), and ammonia (NH 3) as the aluminum, oxygen, and nitrogen precursors, respectively. Deposition rates of Al 2O 3 and AlN at this temperature were ∼1.05 and 0.86 Å/cycle. After the depositions, Al 2O 3- and AlN-coated nanofibers were calcinated at 500°C for 2 h in order to remove organic components. Nanotubes were characterized by using X-ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM), and transmission electron microscopy (TEM). AlN nanotubes were polycrystalline as determined by high resolution TEM (HR-TEM) and selected area electron diffraction (SAED). TEM images of all the samples reported in this study indicated uniform wall thicknesses. © 2012 Materials Research Society.
Open Access
Self-limiting low-temperature growth of crystalline AlN thin films by plasma-enhanced atomic layer deposition
(2012) Ozgit, C.; Donmez I.; Alevli, M.; Bıyıklı, Necmi
We report on the self-limiting growth and characterization of aluminum nitride (AlN) thin films. AlN films were deposited by plasma-enhanced atomic layer deposition on various substrates using trimethylaluminum (TMA) and ammonia (NH 3). At 185 °C, deposition rate saturated for TMA and NH 3 doses starting from 0.05 and 40 s, respectively. Saturative surface reactions between TMA and NH 3 resulted in a constant growth rate of ∼ 0.86 Å/cycle from 100 to 200 °C. Within this temperature range, film thickness increased linearly with the number of deposition cycles. At higher temperatures (≤ 225 °C) deposition rate increased with temperature. Chemical composition and bonding states of the films deposited at 185 °C were investigated by X-ray photoelectron spectroscopy. High resolution Al 2p and N 1s spectra confirmed the presence of AlN with peaks located at 73.02 and 396.07 eV, respectively. Films deposited at 185 °C were polycrystalline with a hexagonal wurtzite structure regardless of the substrate selection as determined by grazing incidence X-ray diffraction. High-resolution transmission electron microscopy images of the AlN thin films deposited on Si (100) and glass substrates revealed a microstructure consisting of nanometer sized crystallites. Films exhibited an optical band edge at ∼ 5.8 eV and an optical transmittance of > 95% in the visible region of the spectrum. © 2011 Elsevier B.V. All rights reserved.
Open Access
Template-based synthesis of AlN hollow nanofibers via plasma-enhanced atomic layer deposition
(2012) Ozgit-Akgun,Çağla; Kayacı, Fatma; Dönmez, İnci; Uyar, Tamer; Bıyıklı, Necmi
Aluminum nitride (AlN) hollow nanofibers were synthesized by depositing conformai thin films via plasma-enhanced atomic layer deposition on sacrificial electrospun nylon 66 nanofiber templates having different average fiber diameters. Scanning electron microscopy studies have shown that there is a critical wall thickness-to-inner diameter ratio for these nanostructures to preserve their shapes after the polymeric template has been removed by calcination. Best morphologies were observed for AlN hollow nanofibers prepared by depositing 800 cycles on templates having ∼330 nm average fiber diameter. Al 2p high resolution XPS subpeaks located at 73.5 ± 0.2 eV confirmed the presence of AlN for coated and calcinated samples. Transmission electron microscopy (TEM) images indicated uniform wall thicknesses along the fiber axes. Synthesized AlN hollow nanofibers were polycrystalline with a hexagonal crystal structure as determined by high resolution TEM and selected area electron diffraction.