Browsing by Subject "GaN"

Now showing 1 - 20 of 47

Open Access
60W stacked-HEMT based asymmetric X-band GaN SPDT switch for single chip T/R modules
(IEEE - Institute of Electrical and Electronics Engineers, 2023-10-25) Ertürk, Volkan; Gürdal, Armağan; Çankaya Akoğlu, Büşra; Özbay, Ekmel
This paper presents a high-power, asymmetric single-pole double-throw (SPDT) monolithic microwave integrated circuit (MMIC) switch using high electron mobility transistors (HEMT) with AlGaN/GaN technology for single chip X-band T/R modules. The SPDT switch is designed in series-shunt topology for high-power handling and low-loss performance. For high-power handling, shunt-stacked HEMTs on the transmit (Tx) path and series-stacked HEMTs on the receive (Rx) path are used. In its Tx mode, the switch has achieved an insertion loss better than 0.75 dB throughout the 6-13 GHz bandwidth with a return loss of 14 dB and an isolation of 28 dB. It can handle more than 60 W RF input power at 0.1 dB compression. In its Rx mode, the switch can receive signals with an insertion loss lower than 1.15 dB with 14 dB return loss and 19 dB isolation. With its low insertion and high-power handling capacity from C-band to Ku-band, this switch shows state-of-the-art performance for communication systems.
Open Access
A1GaN UV photodetectors : from micro to nano
(2011) Bütün, Serkan
The absorption edge of AlGaN based alloys can be tuned from deep UV to near UV by changing the composition. This enables the use of the material in various technological applications such as military, environmental monitoring and biological imaging. In this thesis, we proposed and demonstrated various UV photodetectors for different purposes. The multi-band photodetectors have the unique ability to sense the UV spectrum in different portions at the same time. We demonstrated monolithically integrated dual and four-band photodetectors with multi layer structures grown on sapphire. This was achieved through epitaxial growth of multi AlGaN layers with decreasing Al content. We suggested two different device architectures. First one has separate filter and active layers, whereas the second one has all active layers which are used as filter layers as well. The full width at half maximum (FWHM) values for the dual band photodetector was 11 and 22 nm with more than three orders of magnitude inter-band rejection ratio. The self-filtering four band photodetector has FWHMs of 18, 17, 22 and 9 nm from longer to shorter bands. Whereas photodetector with separate filter layers has FWHMs of 8, 12, 11 and 8 nm, from longer to shorter bands. The overall inter-band rejection ration was increased from about one to two of magnitude after incorporating the passive filter layers. The plasmonic enhancement of photonic devices has attracted much attention for the past decade. However, there is not much research that has been conducted in UV region. In the second part of this thesis, we fabricated nanostructures on GaN based photodetectors and improved the responsivity of the device. We have fabricated Al nano-particles on sapphire with e-beam lithography. We characterized their response via spectral extinction measurements. We integrated these particles with GaN photodetectors and had enhancement of %50 at the plasmonic resonance of the nano-particles. Secondly, we have fabricated sub-wavelength photodetectors on GaN coupled with linear gratings. We had 8 fold enhancement in the responsivity at the plasmonic resonance frequency of the grating at normal incidence. Numerical simulations revealed that both surface plasmons and the unbound leaky surface waves played a role in the enhancement. We, finally, conducted basic research on the current transport mechanisms in Schottky barriers of AlGaN based materials. Experiments revealed that the tunneling current plays a major role in current transport. In addition incorporation, of a thin insulator between metalsemiconductor interface reduces the undesired surface states thereby improving the device performance.
Open Access
Atomic layer deposited HfO2 based metal insulator semiconductor GaN ultraviolet photodetectors
(Elsevier BV, 2014) Kumar, M.; Tekcan, B.; Okyay, Ali Kemal
A report on GaN based metal insulator semiconductor (MIS) ultraviolet (UV) photodetectors (PDs) with atomic layer deposited (ALD) 5-nm-thick HfO2 insulating layer is presented. Very low dark current of 2.24 × 10-11 A and increased photo to dark current contrast ratio was achieved at 10 V. It was found that the dark current was drastically reduced by seven orders of magnitude at 10 V compared to samples without HfO2 insulating layer. The observed decrease in dark current is attributed to the large barrier height which is due to introduction of HfO2 insulating layer and the calculated barrier height was obtained as 0.95 eV. The peak responsivity of HfO2 inserted device was 0.44 mA/W at bias voltage of 15 V.
Open Access
Blue InGaN/GaN-based quantum electroabsorption modulators
(IEEE, 2006) Sarı, Emre; Nizamoğlu, Sedat.; Özel, Tuncay; Demir, Hilmi Volkan
We introduce InGaN/GaN-based quantum electroabsorption modulator that incorporates ∼5 nm thick In0.35Ga0.65N/GaN quantum structures for operation in the blue spectral range of 420-430 nm. This device exhibits an optical absorption coefficient change of ∼6000 cm-1 below the band edge at highly transmissive, blue region (at λ peak=424 nm) with a 6 V swing and emits blue light (at λpeak=440 nm) with an optical output power of 0.35 mW at a 20 mA current injection level. Unlike infrared III-V quantum modulators, this blue modulator shows a blue shift in its electroabsorption (for λ < 418 nm) with increasing applied field accross it, due to high alternating polarization fields in its quantum structures; this electroabsorption behavior is opposite to the conventional quantum confined Stark effect that features common red shift. This device holds great promise for > 10 GHz optical clock injection directly into silicon CMOS chips in the blue because of its low parasitic in-series resistance (< 100 Ω) and the possibility to make smaller device mesas for low capacitance (1.2 fF for a 10μm×10μm mesa size). Considering high-speed operation and high responsivity of silicon-on-insulator (SOI) photodetectors in the blue range, unlike in the infrared, this approach eliminates the need for on-chip hybrid integration of Si CMOS with III-V photodetectors. Furthermore, the efficient electroluminescence of this device makes it feasible to consider on-chip blue laser-modulator integration for a compact optical clocking scheme. © 2006 IEEE.
Open Access
Broadband GaN LNA MMIC development with the micro/nano process development by kink-effect in S22 consideration
(2021-01) Osmanoğlu, Sinan
Broadband low noise ampliﬁers (LNA) are one of the key components of the nu-merous applications such as communication, electronic warfare, and radar. The requirements for higher bandwidth, higher speed, higher survivability, higher re-liability, etc. pushes the technological boundaries. The demand for high per-formance circuit components without a compromise stimulates the utilization of the high-end gallium nitride (GaN) technology to develop better monolithic microwave integrated circuits (MMIC) in a smaller footprint. To support the progress, the development of a proper GaN high electron mobility transistor (HEMT) technology and proper circuit models have become critical. To support the eﬀorts and contribute to the progress, a 0.25 µm microstrip (MS) GaN HEMT technology is developed in Bilkent University Nanotechnology Research Center (NANOTAM). The technology development yields that the MS GaN HEMT tech-nology is capable of supporting ≥4.4 W/mm output power (POUT ), ≥50% power added eﬃciency (PAE), ≥15 dB gain, and ∼1 dB noise ﬁgure (NF ) at 10 GHz. Moreover, the gate structure of the technology is studied by evaluating the kink-eﬀect (KE) in the output reﬂection coeﬃcient (S22) of a HEMT to support the broadband operation. Besides the technology development, the small-signal (SS) and noise equivalent circuit models are studied, and the developed models present high convergence with the measurements. The accuracy of the models contributes to development of the cascode HEMT based LNAs even without fabricating the cascode HEMT. Furthermore, the developed models and the proper gate struc-ture are used to develop the broadband quad-ﬂat no-leads (QFN) packaged GaN LNA MMIC for the mobile radio communications, the military radar, and the commercial radar applications. The results of the circuit models and the GaN LNA MMIC also yield that the developed MS GaN HEMT technology is capable for developing diﬀerent solutions up to 18 GHz.
Open Access
Complementary and alternative technique for the determination of electron effective mass: Quantum hall effect
(Taylor & Francis Inc., 2016) Ardalı, S.; Tiras, E.; Arslan, E.; Özbay, Ekmel
The quantum Hall effect measurements in the AlInN/AlN/GaN heterostructure are studied in the temperature range from 1.8 K to 14 K and a magnetic field up to 11 T. The quantized two-dimensional electron gas was placed at the AlN/GaN interface. The Hall resistance of two-dimensional electron gas has been found to be quantized at multiple integers of von Klitzing constant that refers to the integer quantum Hall effect. The experimental data have been used to determine the Fermi energy, carrier density, and effective mass two-dimensional electrons. The results are in agreement with those derived from the longitudinal magnetoresistance in the same structure.
Open Access
Design, fabrication, and characterization of normally-off GaN HEMTS
(2019-07) Gülseren, Melisa Ekin
GaN-based high-electron-mobility transistors (HEMTs) have been developing rapidly from the time when they were first demonstrated in the 1990s. They have consistently been presented as a displacement technology to silicon based power devices owing to the superior material properties of GaN such as high-electric breakdown field, high-electron saturation velocity, and high mobility. Normally-off GaN HEMT devices are particularly significant in power electronics applications. In this thesis, a comprehensive study of normally-off high-electron-mobility transistors is presented, including theoretical background review, theoretical analysis, physically-based device simulations, device fabrication and optimization and electrical characterization. p-GaN gate InAlN/GaN HEMT and recessed AlGaN/GaN MISHEMT devices have been successfully demonstrated.
Open Access
Development of nano hall sensors for high resolution scanning hall probe microscopy
(2008-09) Dede, Münir
Scanning Hall Probe Microscopy (SHPM) is a quantitative and non invasive method of local magnetic field measurement for magnetic and uperconducting materials with high spatial and field resolution. Since its demonstration in 1992, it is used widely among the scientific community and has already commercialized. In this thesis, fabrication, characterization and SHPM imaging of different nano-Hall sensors produced from heterostructure semiconductors and Bismuth thin films with effective physical probe sizes ranging between 50nm‐1000nm, in a wide temperature range starting from 4.2K up to 425K is presented. Quartz crystal tuning fork AFM feedback is demonstrated for the first time for SHPM over a large temperature range. Its performance has been analyzed in detail and experiments carried with 1×1μm Hall probes has been successfully shown for a hard disk sample in the temperature range of 4.2K to 425K. Other samples, NdFeB demagnetized magnet, Bi substituted iron garnet and, single crystal BSCCO(2212) High Temperature superconductor were also imaged with this method to show the applicability of the method over a wide range of specimens. By this method, complex production steps proposed in the literature to inspect the non‐conductive samples were avoided. A novel Scanning Hall probe gradiometer has also been developed and a new method to image x, y & z components of the magnetic field on the sample surface has been demonstrated for the first time with 1μm resolution. 3D field distribution of a Hard Disk sample is successfully measured at 77K using this novel approach to prove the concept.
Open Access
Effect of deposition technique of SiNx passivation layer on the electrical DC and RF properties of AlGaN/GaN HEMTs
(Springer, 2023-12-07) Güler, Yağmur; Onaylı, Barış; Haliloğlu, Mehmet Taha; Yılmaz, Doğan; Asar, Tarık; Özbay, Ekmel
In this paper, we present the results of a comparative analysis of two alternative SiNx passivation techniques of AlGaN/GaN high electron mobility transistor (HEMT) manufactured using identical epitaxial structure and fabrication processes. AlGaN/GaN HEMT has demonstrated excellent device characteristics, making them excellent candidates for high power, high frequency, and low noise applications. However, the full potential of GaN HEMTs in large signal operation at high frequency is limited by trapping effects and leakage currents at the interface between the epitaxial structure and passivation layer. A SiNx passivation layer has commonly been used to prevent electron trapping at the surface by providing extra positive charges to neutralize trapped negative electrons on the surface. This comparative study investigates the effects of a 75 nm SiNx passivation layer fabricated using both plasma-enhanced chemical vapor deposition (PECVD) and inductively coupled plasma chemical vapor deposition (ICPCVD) techniques on the DC and RF performance of the transistor.
Open Access
Effect of gate structures on the DC and RF performance of AlGaN/GaN HEMTs
(Institute of Physics Publishing, 2018) Toprak, Ahmet; Osmanoǧlu, Sinan; Öztürk, Mustafa; Yılmaz, Doğan; Cengiz, Ö.; Şen, Ö.; Bütün, Bayram; Özcan, Ş.; Özbay, Ekmel
This work analyzes the effect of various gate structures on the DC and radio frequency (RF) performance of AlGaN/GaN high-electron mobility transistors (HEMTs). AlGaN/GaN HEMT devices with a 3 μm drain-to-source spacing, 125 μm gate width and 0.3 μm gate length in various gate structures were fabricated to achieve the desired frequency response with a robust, high yield, and repeatable process. The maximum drain current (IDS,max), maximum DC transconductance (gm), pinch-off voltage (Vth), current-gain cutoff frequency (fT), maximum oscillation frequency (fmax), and RF characteristics of the devices in terms of the small-signal gain and RF output power (Pout) at 8 GHz were investigated. The results showed that the output power is increased by 1 dB when the gate structure is changed from field plate to gamma gate. The Vth, gm, fT and fmax values are maximized when the thickness of the passivation layer between the gate foot and the gate head is minimized. It is shown that the IDS,max is decreased and Pout is increased when the gate recess etching process is performed.
Open Access
Effect of substrate temperature and Ga source precursor on growth and material properties of GaN grown by hollow cathode plasma assisted atomic layer deposition
(IEEE, 2016) Haider, Ali; Kizir, Seda; Deminskyi, P.; Tsymbalenko, Oleksandr; Leghari, Shahid Ali; Bıyıklı, Necmi; Alevli, M.; Gungor, N.
GaN thin films grown by hollow cathode plasma-assisted atomic layer deposition (HCPA-ALD) at two different substrate temperatures (250 and 450 °C) are compared. Effect of two different Ga source materials named as trimethylgallium (TMG) and triethylgallium (TEG) on GaN growth and film quality is also investigated and reviewed. Films were characterized by X-ray photoelectron spectroscopy, spectroscopic ellipsometery, and grazing incidence X-ray diffraction. GaN film deposited by TMG revealed better structural, chemical, and optical properties in comparison with GaN film grown with TEG precursor. When compared on basis of different substrate temperature, GaN films grown at higher substrate temperature revealed better structural and optical properties.
Open Access
Electrical properties and device applications of atomic layer deposited ZnO and GaN thin films
(2014) Bolat, Sami
Zinc oxide (ZnO), a semiconducting material with a wide band gap of 3.37 eV, has become a promising material for wide range of electronic and optoelectronic applications. One of the most important properties of this material is its large exciton binding energy of 60 meV, which makes ZnO a strong candidate for ultraviolet light emitting diodes and lasers. In addition, potentially high electron mobility and the transparency in the visible region strengthen the future of the ZnO based transparent electronics. Although several applications of ZnO have taken their places in the literature, use of ZnO in the thermal imaging applications is yet to be explored. In the parts of this thesis related to ZnO, the temperature coefficient of resistance and electrical noise together with resistivity and contact resistance properties of atomic layer deposition based ZnO are investigated. Due to its remarkably high temperature coefficient of resistance value and suitable 1/f noise corner frequency, this material is proposed as an alternative material to be used in the active layers of uncooled microbolometers. GaN is another wide gap semiconductor which has been intensely investigated throughout the last decades for its potential usage in both optical and electrical applications. Especially, high saturation velocity of the electric carriers of this material has made it a strong candidate to be used in high power applications. Furthermore the high electron mobility transistors based on the 2-dimensional electron gas region formed between the AlGaN and GaN, have found wide range of applications in radio frequency (RF) electronics area. Currently, most commonly used techniques for growing GaN, are metal organic chemical vapor deposition and molecular beam epitaxy. Both of these techniques offer single crystalline layers; however, the process temperatures used in the growth of the GaN disable the use of this material in low temperature flexible electronic/optoelectronic applications. In order to solve this problem, hollow cathode plasma assisted atomic layer deposition technique is utilized and GaN thin films with polycrystalline structures are successfully grown at 200°C. In the parts of this thesis related to GaN, the electrical properties, the effect of contact annealing on the resistivity of the GaN thin films and the contact resistance between this material and Ti/Au metallization scheme are investigated. Afterwards, we present the world’s first thin film transistor with atomic layer deposition based GaN channel and discuss its electrical characteristics in detail. Finally, the GaN thin film transistors are fabricated by performing all fabrication steps at temperatures below 250°C. This is the lowest process thermal budget for the GaN based thin film transistors reported so far. Electrical characteristics as well as the stability of the proposed device are investigated and the results obtained are discussed. Proposed devices are believed to pave the way for the GaN-based stable flexible/transparent electronics after further materials and process optimization.
Open Access
Fabrication and characterization of graphene/AlGaN/GaN ultraviolet Schottky photodetector
(Institute of Physics Publishing, 2016) Kumar, M.; Jeong, H.; Polat, K.; Okyay, Ali Kemal; Lee, D.
We report on the fabrication and characterization of a Schottky ultraviolet graphene/AlGaN/GaN photodetector (PD). The fabricated device clearly exhibits rectification behaviour, indicating that the Schottky barrier is formed between the AlGaN and the mechanically transferred graphene. The Schottky parameters are evaluated using an equivalent circuit with two diodes connected back-to-back in series. The PD shows a low dark current of 4.77 × 10-12 A at a bias voltage of -2.5 V. The room temperature current-voltage (I-V) measurements of the graphene/AlGaN/GaN Schottky PD exhibit a large photo-to-dark contrast ratio of more than four orders of magnitude. Furthermore, the device shows peak responsivity at a wavelength of 350 nm, corresponding to GaN band edge and a small hump at 300 nm associated to the AlGaN band edge. In addition, we examine the behaviour of Schottky PDs with responsivities of 0.56 and 0.079 A W-1 at 300 and 350 nm, respectively, at room temperature. © 2016 IOP Publishing Ltd.
Open Access
Fabrication of ALN/GAN MIS-Hemt with SIN as gate dielectric and performance enhancement with ALD deposited alumina
(2016-10) Sağkal, Sağnak
Silicon based transistors reached a limit, especially for high power and high frequency applications due to their relatively low bandgap and breakdown voltage. With its higher bandgap and breakdown voltage, GaN based transistors are promising devices for high power and high frequency applications. In particular with its high mobility due to the 2D Electron Gas at its interface, AlN/GaN heterostructure is a promisimg option to be used for such applications. High Electron Mobility Transistors(HEMT) fabricated on this heterostructure can work under higher voltages and higher frequencies when compared with standard silicon based transistors due to these superior properties. Also, as current electronics technology is mostly depend on Silicon based circuits, fabrication of these AlN/GaN HEMTs on Silicon substrates will provide easiness to integrate this technology to current systems. However, these transistors can suer from high leakage currents, which can cause a high power consumption problem. One solution to this problem is depositing a dielectric under gate area and such kind of transistors are called as MIS-HEMTs. In this thesis, MOCVD grown AlN/GaN on Silicon samples are used for fabrication of MIS-HEMTs. Before the fabrication of the transistors, a study on formation of ohmic contacts on these samples is performed. Then, two different AlN/GaN MIS-HEMTs with different gate dielectrics are fabricated and characterized. First type of samples have MOCVD grown SiN as gate dielectric and for second type of transistors, an alumina layer is deposited with ALD on top of SiN under gate area to decrease the gate leakage. Both of the transistors can remain gate control up to +2V gate bias. At least a three order of magnitude of decrease in gate leakage current is observed for high negative gate biases after deposition of alumina. Also, a gate leakage current in the order of 10¯¹º-10¯¹¹ A is observed for lower negative biases. A peak transconductance of 2:57mS is obtained for the transistors with gate length of 2µm, which is decreased to 1:71mS after alumina deposition.
Open Access
From model to low noise amplifier monolithic microwave integrated circuit: 0.03–2.6 GHz plastic quad-flat no-leads packaged Gallium-Nitride low noise amplifier monolithic microwave integrated circuit
(John Wiley & Sons Ltd., 2021-01-19) Osmanoğlu, Sinan; Özbay, Ekmel
This paper describes an air cavity quad-flat no-leads (QFN) over-molded plastic packaged cascode broadband GaN LNA Monolithic Microwave Integrated Circuit (MMIC) with resistive feedback fabricated with 0.25 μm GaN HEMT technology. The single stage QFN packaged GaN LNA MMIC achieves a bandwidth of 0.03–2.6 GHz with a typical gain of 11.5 dB and less than 1.5 dB noise figure. The low noise amplifier (LNA) design is based on a model of a concept transistor, the cascode transistor used in the design, that has not been fabricated previously. The concept transistor is fabricated for the first time along with the GaN LNA MMIC. The fabricated GaN LNA MMIC is housed in a 12-lead 3 × 3 mm2 air cavity QFN over-molded plastic package and mounted on an application board. The measurements taken with the application board represent a good convergence with the design that is based on a concept transistor model. The measurement results and 50 Ω internal matching on both ports without the need for additional matching components make this LNA attractive for many applications.
Open Access
Functionalization of group V monolayers and their compounds: alloying, doping and surface modification
(2020-11) Kanlı, Muammer
There has been growing interest during the last decade in two-dimensional (2D) materials due to their important roles in various scientific and technological applications such as detectors, lasers and light emitting diodes. In this thesis we present a theoretical investigation of a couple of such 2D materials from group V monolayers and their compounds. Firstly, ordered alloys of GaxAl1−xN hexagonal monolayer are studied and the effect of Al content on mechanical, electronic, thermal and optical properties are investigated. The optimized lattice constants and band gaps change in accordance to Vegard’s Law. Low barrier energies and favorable substitution of Ga by Al may show feasibility of fabrication. Segregation is also checked with mixing energy calculations. The dynamical stability of alloys is shown by phonon spectrum analysis and MD simulations. GaxAl1−xN alloys give lower in-plane stiffness than h-BN or graphene, but higher Poisson’s ratio than most realized 2D systems. Heat capacity of alloys delivers a decrease with Al content at low temperatures but it converges to the classical limit at high temperatures. The absorption onset of GaxAl1−xN alloys remain in the near UV range and prominent absorption peaks blue-shifts with increasing x in compliance with the variation of the band gap. The considered systems, in regard to their stability and tunable fundamental properties seem to be very promising 2D semiconductors for wide range of applications at reduced scales. Then, the interaction of alkali metal atoms (Li, Na, and K) with single layer and periodic structures of hb-As and sw-As phases are revealed by first-principles methods. Arsenene phases are considered to be used as electrodes (anode) for ion-batteries. Strong alkali-electrode binding and low diffusion energy barriers gives out better cycling stability and faster diffusion, respectively. hb-As shows better storage capacity than sw-As. However, deviations from ordered pattern and decline of formation energy with increasing doping level point out a possible structural transformation. By MD calculations, crystalline to amorphous phase transition is seen even for low concentrations level at ambient temperature. The average open-circuit voltages of 0.68-0.88 V (0.65-0.98 V) with specific capacity up to 715 mAhg−1 (358 mAhg−1) are calculated for single layer (periodic) configurations. Overall, non-crystalline phases are calculated to offer more favorable structures than crystalline configurations and they provide more coherent results when compared with experimental data. The obtained voltage profile together with low diffusion barriers and strong metal-electrode binding suggests arsenene as a promising anode material to be used in for alkali-ion battery applications. Lastly, the formation of dumbbell (DB) geometry upon adsorption of Ga, N adatoms to GaN monolayer is investigated. While Ga-N DBs are unstable, Ga-Ga and N-N DB geometries are predicted to form in an exothermic and spontaneous scheme. Cohesive energy of hexagonal GaN monolayer decreases when a DB is formed on its surface. Electronic structures for Ga-Ga DBs for 2×2, 3×3, 4×4 and 5×5 phases show spinpolarized and degenerate bands mainly contributed by p-orbitals of the atoms in impurity zone. Degenarated bands are not observed for N-N dumbbell for HDP, TDP, 2×2 and 3×3 phases. Upon DB formation, semiconductor GaN monolayer become spin-polarized semiconductor with varying band gap, where this functionalization allows electronic structure to be tuned substantionally. This would be highly desired for nanoscale electronic and optical devices. These Ga-Ga and N-N DB geometries may also be used for the synthesis of layered GaN structures.
Open Access
GaN/AlGaN-based UV photodetectors with performances exceeding the PMTS
(2008) Tut, Turgut
The recent developments in high Al-content AlxGa1−xN material growth technology made it possible to fabricate high performance solar-blind photodetectors operating in the ultraviolet (UV) spectral region with improved receiver sensitivity, low noise, low dark current density, and high speed. AlGaN-based Schottky, p-i-n, and metal-semiconductor-metal photodetectors (MSM) with very high performances have already been demonstrated. The UVfiltering nature of the atmospheric ozone molecules blocks the solar radiation to reach the earth’s surface for wavelengths shorter than 280 nm. In this case, UV photodetectors with cutoff wavelengths around 280 nm, which are also called solarblind detectors, can detect very weak UV signals under intense background radiation. These devices have important applications including missile plume detection, chemical/biological agent sensing, flame alarms, covert space-tospace and submarine communications, ozone-layer monitoring, and gas detection. Due to their high responsivity (600 A/W), high speed, high cathode gain (on the order of a million), and low dark current properties, photomultiplier tubes (PMTs) are frequently used in such applications. However, PMTs are very expensive and bulky. Besides, they require a cooling system, and they have high operation voltages in excess of 1000 V. To achieve solar-blind detection, PMTs should also be integrated with complex and expensive filters. In order to avoid these disadvantages, high performance solid-state UV photodetectors with high internal gain are needed. Wide band-gap semiconductor photodetectors, such as AlxGa1−xN with x=0.4, are ideal candidates for this purpose. These devices are intrinsically solar blind, in which no additional filters are needed, they have low noise, and fast response times. The lack of high internal gain has been the major limitation for the usage of AlGaN photodetectors for applications that require high sensitivity detectors. There have been several theoretical research works that examined the avalanche effect in GaN and AlGaN-based structures. However, reproducible high gain in AlGaN-based APDs is still a major limitation. We have designed, fabricated, GaN/AlGaN based photodetectors, and according to characterization measurements, the Schottky, p-i-n, and avalanche detectors have high performance in terms of quantum efficiency, dark current, detectivity, high speed response, and high reproducible avalanche gain.
Open Access
The growth, fabrication and characterization of high performance AI(formula)Ga(formula)N metal-semiconductor-metal photodiodes
(2006) Bütün, Serkan
High performance UV photodetectors have attracted unwarranted attention for various applications, such as in military, telecommunication, and biological imaging, as an AlxGa1-xN material system is also rather suitable for such applications. Its direct band gap covers the spectrum from 200 nm to 360 nm by way of changing the Al concentration in the compound. In this present thesis, the design and growth of an Al0.75Ga0.25N template on sapphire substrate and a deep-UV photodiode with a cut off wavelength of 229 nm that was fabricated on the Al0.75Ga0.25N template is presented. A responsivity of 0.53 A/W was attained corresponding to a detectivity of 1.64 × 1012 cmHz 1/2/W at a 50 V bias and 222 nm UV light illumination. The UV/VIS rejection ratio of seven orders of magnitude was achieved from the fabricated devices. The second work that was conducted in this thesis was the growth of a semiinsulating (SI-) GaN template. We also fabricated visible-blind photodetectors on this semi-insulating (SI-) GaN template. Furthermore, we fabricated identical samples on a regular GaN template in order to investigate any possible i improvement. The improvement found was obvious in terms of dark current. A dark current density of 1.96 × 10-10 A/cm2 at a 50 V bias voltage for an SI-GaN photodetector was obtained, which is four orders of magnitude lower than devices on a regular GaN template. Devices on an SI-GaN had very high detectivity, and therefore, SI-GaN was used for low level power detection. The photogenerated current was well above the dark current that was under the illumination of just a few picowatts of UV light.
Open Access
High-power and low-loss SPDT switch design using gate-optimized GaN on SiC HEMTs for S-band 5G T/R modules
(2022-07) Ertürk, Volkan
Radio frequency (RF) switches are one the fundamental components of modern communication systems. They enable the routing of high-frequency signals into different transmission paths. Therefore, they play a crucial role in transceiver (T/R) modules. Especially, 5G technology creates a demand for compact switches with high power handling, high isolation, and low insertion loss. GaN on SiC high electron mobility transistor (HEMT) technology stands out with its exceptional electrical and thermal characteristics among other semiconductor technologies. However, switch performance is limited by selected topology and transistor capability. Notably, the T-gate dimensions of the HEMTs directly affect the small-signal and large-signal performance of the switch. This study focuses on designing a single-pole double-throw (SPDT) monolithic microwave integrated circuit (MMIC) switch using gate-optimized HEMT in AlGaN/GaN on SiC technology. The foot length of the gate is varied from 200 nm to 250 nm, and the head length is varied from 500 nm to 750 nm in the T-gate structure to optimize the RF performance. An asymmetric SPDT switch using transistor with 500 nm head length and 250 nm foot length is designed to demonstrate transistor performance. The switch achieved an insertion loss of better than 0.85 dB throughout the 3.2–3.8 GHz bandwidth. The low-noise path can handle 25 W power level, while the high-power path can withstand up to 50 W of RF power at 1 dB compression level. The isolation performance is about 25 dB, while the return loss of the switch is better than 12 dB. The switch occupies a chip area of 2 x 2.2 mm2.
Open Access
High-speed visible-blind GaN-based ITO-Schottky photodiodes
(SPIE, 2002) Bıyıklı, Necmi; Kimukin, İbrahim; Kartaloğlu, Tolga; Aytür, Orhan; Özbay, Ekmel
In this paper we present our efforts on the design, fabrication and characterization of high-speed, visible-blind, GaN-based ultra-violet (UV) photodiodes using indium-tin-oxide (ITO) Schottky contacts. ITO is known as a transparent conducting material for the visible and near infrared part of the electromagnetic spectrum. We have investigated the optical properties of thin ITO films in the ultraviolet spectrum The transmission and reflection measurements showed that thin ITO films had better transparencies than thin Au films for wavelengths greater than 280 mn. Using a microwave compatible fabrication process, we have fabricated Au and ITO based Schottky photediodes on n-/n+ GaN epitaxial layers. We have made current-voltage (I-V), spectral quantum efficiency, and high-speed characterization of the fabricated devices. I-V characterization showed us that the Au-Schottky samples had better electrical characteristics mainly due to the larger Schottky barrier. However, due to the better optical transparency, ITO-Schottky devices exhibited higher quantum efficiencies compared to Au-Schottky devices. ITO-Schottky photodiodes with ∼80 nm thick ITO films resulted in a maximum quantum efficiency of 47%, whereas Au-Schottky photodiode samples with ∼10 nm thick Au films displayed a maximum efficiency of 27% in the visible-blind spectrum. UV/visible rejection ratios over three orders of magnitude were obtained for both samples. High-frequency characterization of the devices was performed via pulse-response measurements at 360 nm. ITO-Schottky photodiodes showed excellent high-speed characteristics with rise times as small as 12 psec and RC-time constant limited pulse-widths of 60 psec.