Thermal conductivity measurements via the bolometric effect
Date
2020
Authors
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Instructor
Source Title
SpringerBriefs in Applied Sciences and Technology
Print ISSN
2191-530X
Electronic ISSN
2191-5318
Publisher
Springer
Volume
Issue
Pages
29 - 50
Language
English
Type
Journal Title
Journal ISSN
Volume Title
Series
SpringerBriefs in Applied Sciences and Technology
Abstract
In this chapter I will introduce the measurement of thermal conductivity using the bolometric effect. The bolometric effect is defined as the resistivity change of a material due to heating. Indeed, the bolometric effect forms the basis of many modern technological sensors and devices. For instance, most commonly used integrated circuit thermometers are based on the well calibrated resistivity change of a Pt strip. Another example is the thermal imaging sensors. A cooled array of high temperature coefficient of resistance material can sensitively detect the infrared spectrum due to the change in the electrical resistance of the active material.
Course
Other identifiers
Book Title
Thermal conductivity measurements in atomically thin materials and devices