Thermal conductivity measurements via the bolometric effect

Date

2020

Editor(s)

Advisor

Supervisor

Co-Advisor

Co-Supervisor

Instructor

Source Title

SpringerBriefs in Applied Sciences and Technology

Print ISSN

2191-530X

Electronic ISSN

2191-5318

Publisher

Springer

Volume

Issue

Pages

29 - 50

Language

English

Journal Title

Journal ISSN

Volume Title

Series

SpringerBriefs in Applied Sciences and Technology

Abstract

In this chapter I will introduce the measurement of thermal conductivity using the bolometric effect. The bolometric effect is defined as the resistivity change of a material due to heating. Indeed, the bolometric effect forms the basis of many modern technological sensors and devices. For instance, most commonly used integrated circuit thermometers are based on the well calibrated resistivity change of a Pt strip. Another example is the thermal imaging sensors. A cooled array of high temperature coefficient of resistance material can sensitively detect the infrared spectrum due to the change in the electrical resistance of the active material.

Course

Other identifiers

Book Title

Thermal conductivity measurements in atomically thin materials and devices

Citation