Monitoring micromechanical buckling at high-speed for sensing and transducer applications

buir.contributor.authorDemiralp, Berke
buir.contributor.authorPisheh, Hadi Sedaghat
buir.contributor.authorKüçükoğlu, Berk
buir.contributor.authorHatipoğlu, Utku
buir.contributor.authorHanay, Mehmet Selim
buir.contributor.orcidHanay, Mehmet Selim|0000-0002-1928-044X
dc.citation.epage630en_US
dc.citation.spage627en_US
dc.contributor.authorDemiralp, Berke
dc.contributor.authorPisheh, Hadi Sedaghat
dc.contributor.authorKüçükoğlu, Berk
dc.contributor.authorHatipoğlu, Utku
dc.contributor.authorHanay, Mehmet Selim
dc.coverage.spatialOrlando, FL, USAen_US
dc.date.accessioned2022-02-08T13:47:56Z
dc.date.available2022-02-08T13:47:56Z
dc.date.issued2021-08-06
dc.departmentDepartment of Mechanical Engineeringen_US
dc.departmentInstitute of Materials Science and Nanotechnology (UNAM)en_US
dc.descriptionConference Name: 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)en_US
dc.descriptionDate of Conference: 20-24 June 2021en_US
dc.description.abstractControlling the amount and direction of buckling at micro- and nano-scale efficiently opens up avenues for novel actuation and sensor applications. Earlier platforms that can achieve a full and non-thermal control of microscopic buckling operated only with a time resolution of 40 ms. Here, we have measured the buckling amount of a beam starting from unbuckled position and reaching to large post-buckling deformations by collecting secondary electrons under scanning electron microscope. Line mode is used for ultrafast measurements with 33kHz scan frequency, and a displacement noise floor of 40pm/√Hz was obtained. Moreover, by further reduction in the device dimensions, the buckling threshold voltage was reduced by a factor of three compared to similar platforms.en_US
dc.description.provenanceSubmitted by Betül Özen (ozen@bilkent.edu.tr) on 2022-02-08T13:47:56Z No. of bitstreams: 1 Monitoring_Micromechanical_Buckling_at_High-Speed_for_Sensing_and_Transducer_Applications.pdf: 2427066 bytes, checksum: 39fa20216e898ef0de26f5f5e5ea756a (MD5)en
dc.description.provenanceMade available in DSpace on 2022-02-08T13:47:56Z (GMT). No. of bitstreams: 1 Monitoring_Micromechanical_Buckling_at_High-Speed_for_Sensing_and_Transducer_Applications.pdf: 2427066 bytes, checksum: 39fa20216e898ef0de26f5f5e5ea756a (MD5) Previous issue date: 2021-08-06en
dc.identifier.doi10.1109/Transducers50396.2021.9495591en_US
dc.identifier.eisbn978-1-6654-1267-4
dc.identifier.eissn2167-0021
dc.identifier.isbn978-1-6654-4845-1
dc.identifier.issn2167-0013
dc.identifier.urihttp://hdl.handle.net/11693/77139
dc.language.isoEnglishen_US
dc.publisherIEEEen_US
dc.relation.isversionofhttps://dx.doi.org/10.1109/Transducers50396.2021.9495591en_US
dc.source.titleInternational Conference on Solid State Sensors and Actuators (TRANSDUCERS)en_US
dc.subjectNEMSen_US
dc.subjectBucklingen_US
dc.subjectPost-bucklingen_US
dc.subjectNanofabricationen_US
dc.subjectScanning electron microscope line modeen_US
dc.titleMonitoring micromechanical buckling at high-speed for sensing and transducer applicationsen_US
dc.typeConference Paperen_US

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