Modeling stress effects on frequencies of a MEMS ring gyroscope

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buir.contributor.authorHosseini-Pishrobat, Mehran
buir.contributor.authorUzunoğlu, Baha Erim
buir.contributor.authorTatar, Erdinç
buir.contributor.orcidHosseini-Pishrobat, Mehran|0000-0002-5866-5131
buir.contributor.orcidUzunoğlu, Baha Erim|0000-0001-6436-5146
buir.contributor.orcidTatar, Erdinç|0000-0002-6093-4994
dc.citation.epage872en_US
dc.citation.spage869
dc.contributor.authorHosseini-Pishrobat, Mehran
dc.contributor.authorUzunoğlu, Baha Erim
dc.contributor.authorTatar, Erdinç
dc.coverage.spatialMunich, Germany
dc.date.accessioned2024-03-08T11:58:44Z
dc.date.available2024-03-08T11:58:44Z
dc.date.issued2023-03-01
dc.departmentDepartment of Electrical and Electronics Engineering
dc.departmentInstitute of Materials Science and Nanotechnology (UNAM)
dc.descriptionConference Name: 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)
dc.descriptionDate of Conference: 15-19 January 2023
dc.description.abstractWe present, for the first time, an analytical model for the external stress effects on the frequencies of a vibrating ring gyroscope (VRG). The stress-induced anchor displacements cause gap changes in the electrodes and nonhomogeneous boundary conditions in the VRG’s suspension structure. Stress stiffness arising from the geometric nonlinearity in the suspension is the principal mechanism affecting VRG’s frequencies as it dominates variations of the electrostatic softening. We validate our model using external stress tests performed on a 57kHz VRG equipped with 16 symmetrically distributed, on-chip capacitive stress sensors, which provide anchor displacement measurements.
dc.description.provenanceMade available in DSpace on 2024-03-08T11:58:44Z (GMT). No. of bitstreams: 1 Modeling_stress_effects_on_frequencies_of_a_MEMS_ring_gyroscope.pdf: 2545409 bytes, checksum: 1efb93855040fa9f90b2483fa757e82c (MD5) Previous issue date: 2023-03-01en
dc.identifier.doi10.1109/MEMS49605.2023.10052439
dc.identifier.eisbn978-1-6654-9308-6
dc.identifier.eissn2160-1968
dc.identifier.isbn978-1-6654-9309-3
dc.identifier.issn1084-6999
dc.identifier.urihttps://hdl.handle.net/11693/114414
dc.language.isoen_US
dc.publisherIEEE
dc.relation.isversionofhttps://dx.doi.org/10.1109/MEMS49605.2023.10052439
dc.source.title2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)
dc.subjectAnalytical modeling
dc.subjectExtensible ring
dc.subjectRing gyroscope
dc.subjectStress sensing
dc.titleModeling stress effects on frequencies of a MEMS ring gyroscope
dc.typeConference Paper

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