Laser nanofabrication deep inside silicon wafers
| buir.contributor.author | Sabet, Rana Asgari | |
| buir.contributor.author | Ishraq, Aqiq | |
| buir.contributor.author | Tokel, Onur | |
| buir.contributor.orcid | Tokel, Onur|0000-0003-1586-4349 | |
| buir.contributor.orcid | Sabet, Rana Asgari|0000-0001-9926-0221 | |
| buir.contributor.orcid | Ishraq, Aqiq|0000-0001-5905-7931 | |
| dc.citation.epage | 1 | en_US |
| dc.citation.spage | 1 | en_US |
| dc.contributor.author | Sabet, Rana Asgari | |
| dc.contributor.author | Ishraq, Aqiq | |
| dc.contributor.author | Tokel, Onur | |
| dc.coverage.spatial | Munich, Germany | en_US |
| dc.date.accessioned | 2022-01-28T12:04:22Z | |
| dc.date.available | 2022-01-28T12:04:22Z | |
| dc.date.issued | 2021-09-30 | |
| dc.department | Institute of Materials Science and Nanotechnology (UNAM) | en_US |
| dc.description | Conference Name: 2021 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC) | en_US |
| dc.description | Date of Conference: 21-25 June 2021 | en_US |
| dc.description.abstract | Here, we introduce the first controlled nanofabrication capability in the bulk of silicon wafers. We exploit smart use of Bessel beams and demonstrate "in-chip" nano-structuring with features lower than 250 nm. | en_US |
| dc.identifier.doi | 10.1109/CLEO/Europe-EQEC52157.2021.9542673 | en_US |
| dc.identifier.eisbn | 978-1-6654-1876-8 | |
| dc.identifier.isbn | 978-1-6654-4804-8 | |
| dc.identifier.uri | http://hdl.handle.net/11693/76878 | |
| dc.language.iso | English | en_US |
| dc.publisher | IEEE | en_US |
| dc.relation.isversionof | https://dx.doi.org/10.1109/CLEO/Europe-EQEC52157.2021.9542673 | en_US |
| dc.source.title | Conference on Lasers and Electro-Optics Europe (CLEO EUROPE) | en_US |
| dc.title | Laser nanofabrication deep inside silicon wafers | en_US |
| dc.type | Conference Paper | en_US |
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