Laser nanofabrication deep inside silicon wafers

Date
2021-09-30
Editor(s)
Advisor
Supervisor
Co-Advisor
Co-Supervisor
Instructor
Source Title
Conference on Lasers and Electro-Optics Europe (CLEO EUROPE)
Print ISSN
Electronic ISSN
Publisher
IEEE
Volume
Issue
Pages
1 - 1
Language
English
Journal Title
Journal ISSN
Volume Title
Series
Abstract

Here, we introduce the first controlled nanofabrication capability in the bulk of silicon wafers. We exploit smart use of Bessel beams and demonstrate "in-chip" nano-structuring with features lower than 250 nm.

Course
Other identifiers
Book Title
Keywords
Citation
Published Version (Please cite this version)