Browsing by Subject "Microfabrication"

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Embargo
Batch-compatible microfabrication of CMUT array chips for photoacoustic imaging of tissue-like phantoms (Part-II)
(2024-01) Mahmood, Muhammad Rashid
In this thesis study, Capacitive Micromachined Ultrasound Transducer (CMUT) array chips are microfabricated with wafer-scale batch-compatible approaches as sensors for photoacoustic imaging (PAI) applications. Photoacoustic imaging (PAI) is a non-invasive medical imaging technology, free from X-ray radiation, that utilizes contrast data resulting from acoustic detection of optical stimulation to construct images. CMUT array devices are microelectromechanical systems (MEMS) devices that generate or detect acoustic or pressure waves within the ultrasonic frequency range. The CMUT devices function on the principle of vibrating parallel plate variable capacitors. Capacitance variations due to vibrating plate electrode create electrical current signals in CMUT cells, which are further processed to obtain meaningful results. In PAI, pulsed laser light is transmit-ted and absorbed by naturally occurring photo-absorber compounds or contrast agents in selective body-tissue or tissue-like materials. The laser pulses are con-verted into heat, resulting in thermoelastic expansion vibrations of the tissue or tissue-like materials (i.e., phantom material). These vibrations travel as pressure or acoustic waves through the tissue or tissue-like materials that may be detected by CMUT sensors. For the production of the CMUT array devices, borosilicate glass (Pyrex-7740) wafers were selected as transparent substrates. The bottom electrode and electrical insulation layer above the bottom electrode of the CMUT sensors are processed on the Pyrex substrates. Anodic wafer bonding is selected as one of the suitable CMUT gap formation and top electrode integration technologies. Clean and unprocessed SOI (silicon-on-insulator) wafers are used for the formation of the top electrode of the CMUT sensors. The silicon handle layer and buried oxide (SiO2) layer of the SOI wafer are removed in order to reveal the silicon device layer that is used as the vibrating top electrode for the CMUT sensors. Metallization stacks on the Silicon device layer have been deposited for electrical conductivity enhancement and wire bonding connections between CMUT top electrodes and printed circuit boards (PCBs). After the patterning of the vibrating top electrode layer, dicing saw processing is done to singulate the CMUT chips from 4-inch diameter wafers. Chip-scale sealing of the CMUT chips is done by conformal Parylene C deposition using UV-sensitive dicing tape as a manual mask to prevent the deposition of Paylene C on the electrical pad regions of the CMUT chips. After Parylene C deposition, UV-sensitive dicing tape is re-moved from chips to reveal the electrical connection pads. CMUT array devices are characterized by inspecting their capacitive gap height, measuring their resonance frequencies, and determining the integration process yield. The resonance frequency results obtained from impedance analyzer measurements of individual CMUT cells are around 5.7 MHz. Furthermore, change in the resonance frequency is clearly detectable when the applied DC bias voltage is increased during the small AC plus incremental DC excitation of CMUT cell membranes.
Open Access
Batch-compatible micromanufacturing of a CMUT array for optoacoustic imaging of tissue-like phantoms
(2021-08) Özyiğit, Doğu Kaan Buğra
Photoacoustic imaging (PAI), also named optoacoustic imaging, is a technol-ogy for medical imaging that relies on contrast data due to optical stimulation. Capacitive micromachined ultrasound transducers (CMUTs) are previously in-troduced for PAI applications. In this thesis, the provided CMUT array design has been partially micro-manufactured separately from electronics and a laser ﬁber light source while re-serving the necessary chip space for integration with electronics and laser ﬁber light source. Batch compatible wafer-scale microfabrication of CMUT arrays was done by a combination of novel as well as traditional MEMS microfabrication pro-cesses. CMUT array gaps, bottom electrodes, and insulation layer were formed on the Pyrex wafer using three separate photolithography masks. Anodic wafer bonding method is used for the formation of the top electrodes and top side of the gap heights of CMUT arrays. Process development for anodic wafer bonding between Pyrex wafers and SOI wafers has been done, where the Pyrex wafers have been previously processed with plasma etching, wet etching, metal stack de-position, insulation layer deposition, and insulation layer patterning, while SOI wafers have been used as received. Pyrex wafers and SOI wafers were anodically bonded to each other with developed anodic wafer bonding processes. After full completion of the micromanufacturing of the CMUT array chips, these CMUT ar-ray chips will be integrated with ASIC chips. Then, CMUT array chips and ASIC chips will be combined with a traditional printed circuit board (PCB). These in-tegrated CMUT array chips, ASIC chips, and PCB are going to be integrated with a ﬁber laser light source inside a mechanically robust hand-held probe that is planned to be used for optoacoustic imaging. The main goal of this CMUT array micromanufacturing study is to signiﬁcantly contribute to the development of one of the necessary components for imaging of a tissue like-phantom using a hand-held imaging probe.
Open Access
Beam steering in a half-frequency driven airborne CMUT transmitter array
(IEEE Computer Society, 2019) Khan, Talha Masood; Taşdelen, Akif Sinan; Yılmaz, Mehmet; Atalar, Abdullah; Köymen, Hayrettin
An airborne Capacitive Micromachined Ultrasonic Transducer (CMUT) transmit array was designed using electromechanical modelling for unbiased airborne operation. The array elements are designed for maximum swing at 10V p-p unbiased drive, whereas conventional practice is to bias CMUT close to the collapsed voltage to achieve higher swing. The devices were fabricated using a customized single photolithographic process with a combination of wet and dry etching. The wafer level fabrication enabled the usage of 2x2 and 3x3 arrays. Driving CMUTs in an unbiased mode at half frequency drives the ‘static pressure’ depressed silicon membrane at a larger swing without letting it collapse. The 2x2 array displays 3.375 kHz bandwidth when characterized in air. The phase and amplitude differences due to the dispersion of resonance frequencies of the elements are compensated for beamformed and beamsteered airborne operation.
Open Access
Deep collapse mode capacitive micromachined ultrasonic transducers
(2010) Olçum, Selim
Capacitive micromachined ultrasonic transducers (CMUTs) are suspended microelectromechanical membrane structures with a moving top electrode and a rigid substrate electrode. The membrane is actuated by electrical signals applied between the electrodes, resulting in radiated pressure waves. CMUTs have several advantages over traditional piezoelectric transducers such as their wider bandwidth and microfabrication methodology. CMUTs as microelectromechanical systems (MEMS), are fabricated using CMOS compatible processes and suitable for batch fabrication. Low cost production of large amount of CMUTs can be fabricated using already established integrated circuit (IC) technology infrastructure. Contrary to piezoelectrics, fabricating large 2-D arrays populated with transducer elements using CMUTs is low-cost. The technological challenges of CMUTs regarding the fabrication and integration issues were solved during the past 15 years, and their successful operation has been demonstrated in many applications. However, commercialization of CMUTs is still an overdue passion for CMUT community. The bandwidth of the CMUTs are inherently superior to their piezoelectric rivals due to the nature of the suspended membrane structure, however, their power output capability must be improved to achieve superior signal-to-noise ratio and penetration depth. In this thesis, we gave a comprehensive discussion about the physics and functionality of CMUTs and showed both theoretically and experimentally that their power outputs can be increased substantially. Using the conventional uncollapsed mode of CMUTs, where the suspended membrane vibrates freely, the lumped displacement of the membrane is limited. Limited displacement, unfortunately, limits the power output of the CMUT. However, a larger lumped displacement is possible in the collapsed state, where the membrane gets in contact with the substrate. By controlling the movement of the membrane in this state, the power output of the CMUTs can be increased. We derived the analytical expressions for the profile of a circular CMUT membrane in both uncollapsed and collapsed states. Using the profiles, we calculated the forces acting on the membrane and the energy radiated to the medium during an applied electrical pulse. We showed that the radiated energy can be increased drastically by utilizing the nonlinear forces on the membrane, well beyond the collapse voltage. Using the analytical expressions, we developed a nonlinear electrical equivalent circuit model that can be used to simulate the mechanical behavior of a transmitting CMUT under any electrical excitation. Furthermore, the model can handle different membrane dimensions and material properties. It can predict the membrane movement in the collapsed state as well as in the uncollapsed state. In addition, it predicts the hysteretic snap-back behavior of CMUTs, when the electric potential across a collapsed membrane is decreased. The nonlinear equivalent circuit was simulated using SPICE circuit simulator, and the accuracy of the model was tested using finite element method (FEM) simulations. Better than 3% accuracy is achieved for the static deflection of a membrane as a function of applied DC voltage. On the other hand, the pressure output of a CMUT under large signal excitation is predicted within 5% accuracy. Using the developed model, we explained the dynamics of a CMUT membrane. Based on our physical understanding, we proposed a new mode of operation, the deep collapse mode, in order to generate high power acoustic pulses with large bandwidth (>100% fractional) at a desired center frequency. We showed both by simulation (FEM and equivalent circuit) and by experiments that the deep collapse mode increases the output pressure of a CMUT, substantially. The experiments were performed on CMUTs fabricated at Bilkent University by a sacrificial release process. Larger than 3.5 MPa peak-to-peak acoustic pulses were measured on CMUT surface with more than 100% fractional bandwidth around 7 MHz using an electrical pulse amplitude of 160 Volts. Furthermore, we optimized the deep collapse mode in terms of CMUT dimensions and parameters of the applied electrical pulse, i.e., amplitude, rise and fall times, pulse width and polarity. The experimental results were compared to dynamic FEM and equivalent circuit simulations. We concluded that the experimental results are in good agreement with the simulations. We believe that CMUTs, with their high transmit power capability in the deep collapse mode can become a strong competitor to piezoelectrics.
Open Access
Design, fabrication and operation of a very high intensity CMUT transmit array for beam steering applications
(2020-12) Khan, Talha Masood
Several studies have reported airborne ultrasound transmission systems focused on achieving beamforming. However, beam steering and beamforming for capacitive micromachined ultrasonic transducers (CMUTs) at high intensity remains to be accomplished. CMUTs, like other ultrasonic transducers, incorporate a loss mechanism to obtain a wide bandwidth. They are restricted to a limited amount of plate swing due to the gap between the radiating plate and the bottom electrode, along with a high dc bias operation. CMUTs can be designed to produce high-intensity ultrasound by employing an unbiased operation. This mode of operation allows the plate to swing the entire gap without collapsing, thus enabling higher intensity. In this study, we use an equivalent circuit-based model to design unbiased CMUT arrays driven at half the mechanical frequency. This model is cross verified using finite element analysis (FEA). CMUT arrays are produced in multiple configurations using a customized microfabrication process that involves anodic wafer bonding, a single lithographic mask, and a shadow mask. We use impedance measurements to characterize the microfabricated devices. We experimentally obtained the highest reported intensity using a microfabricated 2×2 CMUT array driven at resonance in a pulsed configuration. This array is also capable of beam steering and beamforming at a high intensity such that it can steer the entire half-space. The beam obtained from the array is in excellent agreement with the theoretical predictions. The amplitude and phase compensation for the devices remain constant that makes these arrays attractive for applications involving park assist, gesture recognition, and tactile displays.
Open Access
Designing, fabrication and post- fabrication characterization of half-frequency driven 16 x 16 waterborne transmit CMUT array
(2021-02) Abhoo, Yusuph Abubakar
Capacitive Micromachined Ultrasonic Transducers (CMUT) are micro-scaled electromechanical devices which are used to either transmit or receive pressure signals and applicable for various purposes such as ultrasonic sensor, medical imaging, accurate biometric sensing and parametric speakers. For transmitting CMUT transducer, different sizes and array configurations are used to intensify the transmission power depending on the application. The half-frequency driven waterborne transmitting CMUT array designed in this work is to be used for high resolution volumetric medical imaging purpose. This was accomplished by a design which prioritizes maximizing the power output, achieving a directive radiation pattern with low sidelobes which maximizes the beamformable region. In this work, the issues with steering of the focused beam are also resolved to achieve a focused steerable beam. This work is an advancement from the earlier designed half-frequency driven airborne transmit CMUT to improve power output, introduce the beamforming and focused transmission capabilities and be applicable for high resolution volumetric medical imaging purpose. To improve the power output, the design was made to compensate for the static depression. Compensating for static depression was achieved by designing to operate the CMUT without DC bias voltage which allows for full-gap swing and giving output signal of twice the input frequency. This property allows the cell to produce high power output with low voltage levels but also brings the advantage of operating the cell with very high voltages without collapsing. The CMUT was chosen to be operating at 7.5 MHz and be driven by Digital Phased Array System (DiPhAS) which allowed to have maximum of 256 channels which for volumetric transmission meant a maximum of 16 x 16 array. Since the radiation pattern and Rayleigh distance are both the functions of radius, frequency and the pitch, the design optimization was found while considering all the above preferences simultaneously. The cells’ radii were determined to be 80 µm, the plate thickness was 15 µm, the gap height was found to be 117 nm and the pitch was 192 µm. The array designing was carried out using the large-signal equivalent circuit model and the radiation impedance matrix phenomenon. The simulations showed that with this design, the maximized Rayleigh distance was 45.3 mm and the sidelobe of -17.4 dB. In simulations, very high pressure outputs were achievable with individual cells up to 425 kPa per cell with 150 VPP input while up to 1.5 MPa was emitted by the array plane wave transmission with only 10 VPP input and almost doubles when the transmitted beam was focused at zero degrees. Fabrication was done by the wafer boding and flip-chip bonding techniques where the whole process required only two lithography masks. After fabrication, the tests were performed to identify the yield of the transducer was 18.75% of the array then impedance analysis was done to characterize the functional cells and resonance frequency drift. The transducer was cased in a water-tight manner and the waterborne transmission were done with individual cells to characterize and compare the performance with the design simulations which were in the range of agreement achieving an average of 1625 Pa per cell. The functional cells were then used for plane wave transmission with 10 VPP and the output pressure of 397 kPa was achieved at resonance frequency. The measurement results showed that the design could further be improved by compensating the active area to improve the yield for better results and be able to use it for high resolution 3D medical imaging.
Open Access
Fourier transform plasmon resonance spectrometer using nanoslit-nanowire pair
(American Institute of Physics, 2019) Uulu, Doolos Aibek; Ashirov, Timur; Polat, N.; Yakar, O.; Balcı, S.; Kocabaş, C.
In this paper, we present a nanoscale Fourier transform spectrometer using a plasmonic interferometer consisting of a tilt subwavelength slit-nanowire pair on a metallic surface fabricated by the focused ion beam microfabrication technique. The incident broadband light strongly couples with the surface plasmons on the gold surface, and thus, surface plasmon polaritons (SPPs) are generated. The launched SPPs interfere with the incident light and generate high contrast interference fringes in the nanoslit. The transmitted SPPs through the metal nanoslit can decouple into free space and are collected by an objective in the far field. The spectroscopic information of the incidence light is obtained by fast Fourier transform of the fringe pattern of the SPPs. In our design, there is no need for a bulky dispersive spectrometer or dispersive optical elements. The dimension of the spectrometer is around 200 μm length. Our design is based on inherent coherence of the SPP waves propagating through the subwavelength metal nanoslit structures etched into an opaque gold film.
Open Access
High-efficiency multilevel volume diffraction gratings inside silicon
(American Chemical Society, 2023-11-08) Bütün, Mehmet; Saylan, Sueda; Sabet, Rana Asgari; Tokel, Onur
Silicon (Si)-based integrated photonics is considered to play a pivotal role in multiple emerging technologies, including telecommunications, quantum computing, and lab-chip systems. Diverse functionalities are either implemented on the wafer surface (“on-chip”) or recently within the wafer (“in-chip”) using laser lithography. However, the emerging depth degree of freedom has been exploited only for single-level devices in Si. Thus, monolithic and multilevel discrete functionality is missing within the bulk. Here, we report the creation of multilevel, high-efficiency diffraction gratings in Si using three-dimensional (3D) nonlinear laser lithography. To boost device performance within a given volume, we introduce the concept of effective field enhancement at half the Talbot distance, which exploits self-imaging onto discrete levels over an optical lattice. The novel approach enables multilevel gratings in Si with a record efficiency of 53%, measured at 1550 nm. Furthermore, we predict a diffraction efficiency approaching 100%, simply by increasing the number of levels. Such volumetric Si-photonic devices represent a significant advance toward 3D-integrated monolithic photonic chips.
Open Access
Oil droplet manipulation on superomniphobic textured surfaces
(2020-07) Yelekli, Ecem
Microfluidic systems are mostly composed of closed microchannels in which flow is generated by syringe or pressure pumps. The flow in these channels can be droplet-based however access to each droplet individually in these systems is not possible. As an alternative approach to these channel-based devices, droplets can also be manipulated on surfaces by generating surface energy gradients. Since in these systems droplets can be handled individually and samples can be carried in small packages, these systems can perform more controlled operations. For instance, the concentration and volume of the samples can be adjusted more precisely. These systems can be very useful for biological analysis as well as chemical synthesis. Until now, transport of water droplets by using surface energy gradients has been demonstrated in literature. On the other hand, controlled transport of oil droplets on surfaces remained as a challenging task because of their low surface tension. In addition, in the literature, most of the work about oil droplet transportation was carried out in an aqueous environment, and therefore it restricts its potential for applications. This work demonstrates the transportation of microliter sized oil droplets by utilizing textured superomniphobic surfaces in a controlled way for the first time. By applying vertical vibration to the surface, oil droplets overcome hysteresis and move by following the textured tracks. Superoleophobicity is required to decrease the affinity of oil on the surface so that the motion of droplets can be achieved. This system has advantages such as the ability to control droplet motion individually by using a single input (vertical vibration) as well as mixing droplets in precise ratios, preventing clogging in channels and cross contamination as well as eliminating the usage of syringe pumps. In this project, initial focus was on examining the topography effect on superoleophobicity and fabricating superomniphobic surfaces. Surfaces were fabricated on silicon wafers by using conventional lithography technique. In this stage, two different microstructure profile was used on the surfaces: mushroom microstructure and straight sided microstructure. It was observed that mushroom microstructures were required to maintain superoleophobicity. Also, the effect of side length of microstructures, the distance between the microstructures and TiO2 coating on wettability were investigated. In order to achieve oil droplet transportation, superomniphobic textured surfaces were developed and these surfaces were tested by applying vertical vibration. As a final aim of this project, these surfaces were used for the nanoparticle synthesis.
Open Access
Rapid fabrication of microfluidic PDMS devices from reusable PDMS molds using laser ablation
(Institute of Physics Publishing, 2016) Isiksacan, Z.; Guler, M. T.; Aydogdu, B.; Bilican, I.; Elbuken, C.
The conventional fabrication methods for microfluidic devices require cleanroom processes that are costly and time-consuming. We present a novel, facile, and low-cost method for rapid fabrication of polydimethylsiloxane (PDMS) molds and devices. The method consists of three main fabrication steps: female mold (FM), male mold (MM), and chip fabrication. We use a CO2 laser cutter to pattern a thin, spin-coated PDMS layer for FM fabrication. We then obtain reusable PDMS MM from the FM using PDMS/PDMS casting. Finally, a second casting step is used to replicate PDMS devices from the MM. Demolding of one PDMS layer from another is carried out without any potentially hazardous chemical surface treatment. We have successfully demonstrated that this novel method allows fabrication of microfluidic molds and devices with precise dimensions (thickness, width, length) using a single material, PDMS, which is very common across microfluidic laboratories. The whole process, from idea to device testing, can be completed in 1.5 h in a standard laboratory.
Open Access
A simple approach for the fabrication of 3D microelectrodes for impedimetric sensing
(Institute of Physics Publishing, 2015) Guler, M. T.; Bilican, I.; Agan, S.; Elbuken, C.
In this paper, we present a very simple method to fabricate three-dimensional (3D) microelectrodes integrated with microfluidic devices. We form the electrodes by etching a microwire placed across a microchannel. For precise control of the electrode spacing, we employ a hydrodynamic focusing microfluidic device and control the width of the etching solution stream. The focused widths of the etchant solution and the etching time determine the gap formed between the electrodes. Using the same microfluidic device, we can fabricate integrated 3D electrodes with different electrode gaps. We have demonstrated the functionality of these electrodes using an impedimetric particle counting setup. Using 3D microelectrodes with a diameter of 25 μm, we have detected 6 μm-diameter polystyrene beads in a buffer solution as well as erythrocytes in a PBS solution. We study the effect of electrode spacing on the signal-to-noise ratio of the impedance signal and we demonstrate that the smaller the electrode spacing the higher the signal obtained from a single microparticle. The sample stream is introduced to the system using the same hydrodynamic focusing device, which ensures the alignment of the sample in between the electrodes. Utilising a 3D hydrodynamic focusing approach, we force all the particles to go through the sensing region of the electrodes. This fabrication scheme not only provides a very low-cost and easy method for rapid prototyping, but which can also be used for applications requiring 3D electric field focused through a narrow section of the microchannel.
Open Access
Surface integrated membrane nanomechanical and microwave coplanar waveguide based biosensors
(2018-08) Aslanbaş, Levent
Nanoelectromechanical Systems, or NEMS, is the further miniaturized extension of novel devices of 40 years ago, Microelectromechanical Systems or MEMS in short. Nano scale devices first appeared at the dawn of 21st century and they are well established and elaborated by this time to a point which it shapes the technological paradigm of the current decade with various applications such as gene sequencing, improved computers and single molecule detection. The rapid improvement of miniaturization tecniques owes a great deal to the hard work of scientists and engineers of previous generation. Fabrication methods which were limited to a small number which disallowed sub-micron features are improved and new methods have been discovered within the previous decades. This has paved the way for creation of very sensitive sensors in NEMS domain. In this study, a novel biosensor is designed and attempted to be created out of coplanar waveguide resonators which is constructed on top of a nanometers thick membrane and at the sensory region of the resonator a nanopore is proposed to be created. The nanopore is suggested in order to allow nano-particle carrier fluids to pass through the most sensitive region of the resonator, causing a change in its resonant frequency due to electrical property of the nano-particle. The frequency shift caused by particles is suggested to be used to detect and characterize the particles. The particles in this case are planned to be exosomes which are sub-micron packages with cytoplasmic content, naturally secreted by cells for various reasons. Contents of the exosomes may carry diagnostic information about the cell. Exosomes themselves are still being investigated for their uses and benefits within the context of microbiology which makes the proposed device very crucial for ongoing exosome research effort which is still on the rise.
Open Access
Terahertz Bandpass Frequency Selective Surfaces on Glass Substrates Using a Wet Micromachining Process
(Springer New York LLC, 2017) Ramzan, Mehrab; Khan, Talha Masood; Bolat, Sami; Nebioglu, Mehmet Ali; Altan, Hakan; Okyay, Ali Kemal; Topallı, Kağan
This paper presents terahertz (THz) frequency selective surfaces (FSS) implemented on glass substrate using standard microfabrication techniques. These FSS structures are designed for frequencies around 0.8 THz. A fabrication process is proposed where a 100-μm-thick glass substrate is formed through the HF etching of a standard 500-μm-thick low cost glass wafer. Using this fabrication process, three separate robust designs consisting of single-layer FSS are investigated using high-frequency structural simulator (HFSS). Based on the simulation results, the first design consists of a circular ring slot in a square metallic structure on top of a 100-μm-thick Pyrex glass substrate with 70% transmission bandwidth of approximately 0.07 THz, which remains nearly constant till 30° angle of incidence. The second design consists of a tripole structure on top of a 100-μm-thick Pyrex glass substrate with 65% transmission bandwidth of 0.035 THz, which remains nearly constant till 30° angle of incidence. The third structure consists of a triangular ring slot in a square metal on top of a 100-μm-thick Pyrex glass substrate with 70% transmission bandwidth of 0.051 THz, which remains nearly constant up to 20° angle of incidence. These designs show that the reflections from samples can be reduced compared to the conventional sample holders used in THz spectroscopy applications, by using single layer FSS structures manufactured through a relatively simple fabrication process. Practically, these structures are achieved on a fabricated 285-μm-thick glass substrate. Taking into account the losses and discrepancies in the substrate thickness, the measured results are in good agreement with the electromagnetic simulations. © 2017, Springer Science+Business Media New York.
Open Access
Three dimensional microfabricated broadband patch and multifunction reconfigurable antennae for 60 GHz applications
(IEEE, 2015-04) Hünerli H. V.; Mopidevi, H.; Cağatay, E.; Imbert, M.; Romeu, J.; Jofre, L.; Çetiner, B. A.; Bıyıklı, Necmi
In this paper we present two antenna designs capable of covering the IEEE 802.11ad (WiGig) frequency band (57-66 GHz and 59-66 GHz respectively). The work below reports the design, microfabrication and characterization of a broadband patch antenna along with the design and microfabrication of multifunction reconfigurable antenna (MRA) in its static form excluding active switching. The first design is a patch antenna where the energy is coupled with a conductor-backed (CB) coplanar waveguide (CPW)-fed loop slot, resulting in a broad bandwidth. The feed circuitry along with the loop is formed on a quartz substrate (at 60 GHz), on top of which an SU-8-based three-dimensional (3D) structure with air cavities is microfabricated. The patch metallization is deposited on top of this structure. The second design is a CB CPW-fed loop slot coupled patch antenna with a parasitic layer on top. The feed circuitry along with the loop is formed on a quartz substrate. On top, the patch metallization is patterned on another quartz substrate. The parasitic pixels are deposited on top of these two quartz layers on top of an SU-8 based 3D structure with air cavities. © 2015 EurAAP.
Open Access
Xenon difluoride dry etching for the microfabrication of solid microneedles as a potential strategy in transdermal drug delivery
(Wiley-VCH Verlag GmbH & Co. KGaA, 2023-07-23) Eş, İsmail; Kafadenk, Abdullah; Görmüş, M. Burak; İnci, Fatih
Although hypodermic needles are a “gold standard” for transdermal drug delivery (TDD), microneedle (MN)-mediated TDD denotes an unconventional approach in which drug compounds are delivered via micron-size needles. Herein, an isotropic XeF2 dry etching process is explored to fabricate silicon-based solid MNs. A photolithographic process, including mask writing, UV exposure, and dry etching with XeF2 is employed, and the MN fabrication is successfully customized by modifying the CAD designs, photolithographic process, and etching conditions. This study enables fabrication of a very dense MNs (up to 1452 MNs cm−2) with height varying between 80 and 300 µm. Geometrical features are also assessed using scanning electron microscopy (SEM) and 3D laser scanning microscope. Roughness of the MNs are improved from 0.71 to 0.35 µm after titanium and chromium coating. Mechanical failure test is conducted using dynamic mechanical analyzer to determine displacement and stress/strain values. The coated MNs are subjected to less displacement (≈15 µm) upon the applied force. COMSOL Multiphysics analysis indicates that MNs are safe to use in real-life applications with no fracture. This technique also enables the production of MNs with distinct shape and dimensions. The optimized process provides a wide range of solid MN types to be utilized for epidermis targeting.