Low temperature thin films transistors with hollow cathode plasma-assisted atomic layer deposition based GaN channels
buir.contributor.author | Bıyıklı, Necmi | |
buir.contributor.author | Okyay, Ali Kemal | |
dc.citation.epage | 243505-3 | en_US |
dc.citation.issueNumber | 24 | en_US |
dc.citation.spage | 243505-1 | en_US |
dc.citation.volumeNumber | 104 | en_US |
dc.contributor.author | Bolat, S. | en_US |
dc.contributor.author | Ozgit Akgun, C. | en_US |
dc.contributor.author | Tekcan, B. | en_US |
dc.contributor.author | Bıyıklı, Necmi | en_US |
dc.contributor.author | Okyay, Ali Kemal | en_US |
dc.date.accessioned | 2015-07-28T12:02:53Z | |
dc.date.available | 2015-07-28T12:02:53Z | |
dc.date.issued | 2014 | en_US |
dc.department | Department of Electrical and Electronics Engineering | en_US |
dc.department | Nanotechnology Research Center (NANOTAM) | en_US |
dc.department | Institute of Materials Science and Nanotechnology (UNAM) | en_US |
dc.description.abstract | We report GaN thin film transistors (TFT) with a thermal budget below 250 °C. GaN thin films are grown at 200 °C by hollow cathode plasma-assisted atomic layer deposition (HCPA-ALD). HCPA-ALD-based GaN thin films are found to have a polycrystalline wurtzite structure with an average crystallite size of 9.3 nm. TFTs with bottom gate configuration are fabricated with HCPA-ALD grown GaN channel layers. Fabricated TFTs exhibit n-type field effect characteristics. N-channel GaN TFTs demonstrated on-to-off ratios (ION/I OFF) of 103 and sub-threshold swing of 3.3 V/decade. The entire TFT device fabrication process temperature is below 250 °C, which is the lowest process temperature reported for GaN based transistors, so far. © 2014 AIP Publishing LLC. | en_US |
dc.identifier.doi | 10.1063/1.4884061 | en_US |
dc.identifier.issn | 0003-6951 | |
dc.identifier.uri | http://hdl.handle.net/11693/12762 | |
dc.language.iso | English | en_US |
dc.publisher | AIP Publishing LLC | en_US |
dc.relation.isversionof | http://dx.doi.org/10.1063/1.4884061 | en_US |
dc.source.title | Applied Physics Letters | en_US |
dc.subject | Atomic Layer Deposition | en_US |
dc.subject | Budget Control | en_US |
dc.subject | Cathodes | en_US |
dc.subject | Deposition | en_US |
dc.subject | Gallium Nitride | en_US |
dc.subject | Pulsed Laser Deposition | en_US |
dc.subject | Thin Films | en_US |
dc.subject | Zinc Sulfide | en_US |
dc.title | Low temperature thin films transistors with hollow cathode plasma-assisted atomic layer deposition based GaN channels | en_US |
dc.type | Article | en_US |
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