Modeling the effect of subsurface interface defects on contact stiffness for ultrasonic atomic force microscopy

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buir.contributor.orcidAtalar, Abdullah|0000-0002-1903-1240
dc.citation.epage5370en_US
dc.citation.issueNumber26en_US
dc.citation.spage5368en_US
dc.citation.volumeNumber84en_US
dc.contributor.authorSarioglu, A. F.en_US
dc.contributor.authorAtalar, Abdullahen_US
dc.contributor.authorDegertekin, F. L.en_US
dc.date.accessioned2016-02-08T10:26:43Z
dc.date.available2016-02-08T10:26:43Z
dc.date.issued2004en_US
dc.departmentDepartment of Electrical and Electronics Engineeringen_US
dc.departmentInstitute of Materials Science and Nanotechnology (UNAM)en_US
dc.description.abstractWe present a model predicting the effects of mechanical defects at layer interfaces on the contact stiffness measured by ultrasonic atomic force microscopy sAFMd. Defects at subsurface interfaces result in changes at the local contact stiffness between the AFM tip and the sample. Surface impedance method is employed to model the imperfections and an iterative algorithm is used to calculate the AFM tip-surface contact stiffness. The sensitivity of AFM to voids or delaminations and disbonds is investigated for film-substrate combinations commonly used in microelectronic structures, and optimum defect depth for maximum sensitivity is defined. The effect of contact force and the tip properties on the defect sensitivity are considered. The results indicate that the ultrasonic AFM should be suitable for subsurface detection and its defect sensitivity can be enhanced by adjusting the applied force as well as by judicious choice of the AFM tip material and geometry.en_US
dc.description.provenanceMade available in DSpace on 2016-02-08T10:26:43Z (GMT). No. of bitstreams: 1 bilkent-research-paper.pdf: 70227 bytes, checksum: 26e812c6f5156f83f0e77b261a471b5a (MD5) Previous issue date: 2004en
dc.identifier.doi10.1063/1.1764941en_US
dc.identifier.eissn1077-3118
dc.identifier.issn0003-6951
dc.identifier.urihttp://hdl.handle.net/11693/24273
dc.language.isoEnglishen_US
dc.publisherAIP Publishing LLCen_US
dc.relation.isversionofhttp://dx.doi.org/10.1063/1.1764941en_US
dc.source.titleApplied Physics Lettersen_US
dc.subjectDisbondsen_US
dc.subjectSubsurface detectionen_US
dc.subjectSubsurface interfaceen_US
dc.subjectSurface impedanceen_US
dc.subjectAlgorithmsen_US
dc.subjectAtomic force microscopyen_US
dc.subjectBoundary conditionsen_US
dc.subjectDefectsen_US
dc.subjectElectronic structureen_US
dc.subjectIterative methodsen_US
dc.subjectSubstratesen_US
dc.subjectUltrasonicsen_US
dc.subjectStiffnessen_US
dc.titleModeling the effect of subsurface interface defects on contact stiffness for ultrasonic atomic force microscopyen_US
dc.typeArticleen_US

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