Interfacial charge and energy transfer in van der Waals heterojunctions

buir.contributor.authorDemir, Hilmi Volkan
buir.contributor.orcidDemir, Hilmi Volkan|0000-0003-1793-112X
dc.citation.epage21en_US
dc.citation.issueNumber3en_US
dc.citation.spage1en_US
dc.citation.volumeNumber4en_US
dc.contributor.authorHu, Zehua
dc.contributor.authorLiu, Xue
dc.contributor.authorHernández-Martínez, Pedro Ludwig
dc.contributor.authorZhang, Shishu
dc.contributor.authorGu, Peng
dc.contributor.authorDu, Wei
dc.contributor.authorXu, Weigao
dc.contributor.authorDemir, Hilmi Volkan
dc.contributor.authorLiu, Haiyun
dc.contributor.authorXiong, Qihua
dc.date.accessioned2023-02-27T15:45:54Z
dc.date.available2023-02-27T15:45:54Z
dc.date.issued2022-03
dc.departmentDepartment of Electrical and Electronics Engineeringen_US
dc.departmentDepartment of Physicsen_US
dc.departmentInstitute of Materials Science and Nanotechnology (UNAM)en_US
dc.departmentNanotechnology Research Center (NANOTAM)en_US
dc.description.abstractVan der Waals heterojunctions are fast-emerging quantum structures fabricated by the controlled stacking of two-dimensional (2D) materials. Owing to the atomically thin thickness, their carrier properties are not only determined by the host material itself, but also defined by the interlayer interactions, including dielectric environment, charge trapping centers, and stacking angles. The abundant constituents without the limitation of lattice constant matching enable fascinating electrical, optical, and magnetic properties in van der Waals heterojunctions toward next-generation devices in photonics, optoelectronics, and information sciences. This review focuses on the charge and energy transfer processes and their dynamics in transition metal dichalcogenides (TMDCs), a family of quantum materials with strong excitonic effects and unique valley properties, and other related 2D materials such as graphene and hexagonal-boron nitride. In the first part, we summarize the ultrafast charge transfer processes in van der Waals heterojunctions, including its experimental evidence and theoretical understanding, the interlayer excitons at the TMDC interfaces, and the hot carrier injection at the graphene/TMDCs interface. In the second part, the energy transfer, including both Förster and Dexter types, are reviewed from both experimental and theoretical perspectives. Finally, we highlight the typical charge and energy transfer applications in photodetectors and summarize the challenges and opportunities for future development in this field. © 2022 The Authors. InfoMat published by UESTC and John Wiley & Sons Australia, Ltd.en_US
dc.description.provenanceSubmitted by Cem Çağatay Akgün (cem.akgun@bilkent.edu.tr) on 2023-02-27T15:45:54Z No. of bitstreams: 1 Interfacial_charge_and_energy_transfer_in_van_der_Waals_heterojunctions.pdf: 12341018 bytes, checksum: db3949a153285ddbd93453ed00185b0b (MD5)en
dc.description.provenanceMade available in DSpace on 2023-02-27T15:45:54Z (GMT). No. of bitstreams: 1 Interfacial_charge_and_energy_transfer_in_van_der_Waals_heterojunctions.pdf: 12341018 bytes, checksum: db3949a153285ddbd93453ed00185b0b (MD5) Previous issue date: 2022-03en
dc.identifier.doi10.1002/inf2.12290en_US
dc.identifier.eissn2567-3165
dc.identifier.urihttp://hdl.handle.net/11693/111843
dc.language.isoEnglishen_US
dc.publisherJohn Wiley and Sons Incen_US
dc.relation.isversionofhttps://dx.doi.org/10.1002/inf2.12290en_US
dc.source.titleInfoMaten_US
dc.subject2-dimensional semiconductorsen_US
dc.subjectCarrier dynamicsen_US
dc.subjectCharge and energy transferen_US
dc.subjectOptical spectroscopyen_US
dc.subjectOptoelectronicsen_US
dc.titleInterfacial charge and energy transfer in van der Waals heterojunctionsen_US
dc.typeArticleen_US

Files

Original bundle
Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
Interfacial_charge_and_energy_transfer_in_van_der_Waals_heterojunctions.pdf
Size:
11.77 MB
Format:
Adobe Portable Document Format
Description:
License bundle
Now showing 1 - 1 of 1
No Thumbnail Available
Name:
license.txt
Size:
1.69 KB
Format:
Item-specific license agreed upon to submission
Description: