A high-performance hybrid memory architecture for embedded CMPs using a convex optimization model

Date

2015-11

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ISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE)

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IEEE

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261 - 262

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English

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Abstract

In this article, we present a convex optimization model to design a stacked hybrid memory system for 3D embedded chip-multiprocessors (eCMP). Our convex model optimizes numbers and placement of SRAM and STT-RAM memories on the memory layer, and maps applications/threads on cores in the core layer effectively. The detailed proposed model satisfies the power constraint which is the main challenge of dark-silicon era. Experimental results show that the proposed architecture considerably improves the energy-delay product (EDP) and performance of the 3D eCMP compared to the Baseline memory design. © 2015 IEEE.

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