High performance n-MOSFETs with novel source/drain on selectively grown Ge on Si for monolithic integration
buir.contributor.author | Okyay, Ali Kemal | |
dc.citation.epage | 29.4.4 | en_US |
dc.citation.spage | 29.4.1 | en_US |
dc.contributor.author | Yu, H.-Y. | en_US |
dc.contributor.author | Kobayashi, M. | en_US |
dc.contributor.author | Jung, W. S. | en_US |
dc.contributor.author | Okyay, Ali Kemal | en_US |
dc.contributor.author | Nishi, Y. | en_US |
dc.contributor.author | Saraswat, K. C. | en_US |
dc.coverage.spatial | Baltimore, MD, USA | en_US |
dc.date.accessioned | 2016-02-08T12:26:17Z | |
dc.date.available | 2016-02-08T12:26:17Z | |
dc.date.issued | 2009 | en_US |
dc.department | Department of Electrical and Electronics Engineering | en_US |
dc.description | Date of Conference: 7-9 December 2009 | en_US |
dc.description | Conference Name: 2009 IEEE International Electron Devices Meeting, IEDM 2009 | en_US |
dc.description.abstract | We demonstrate high performance Ge n-MOSFETs with novel raised source/drain fabricated on high quality single crystal Ge selectively grown heteroepitaxially on Si using Multiple Hydrogen Anealing for Heteroepitaxy(MHAH) technique. Until now low source/drain series resistance in Ge n-MOSFETs has been a highly challenging problem. Source and drain are formed by implant-free, in-situ doping process for the purpose of very low series resistance and abrupt and shallow n+/p junctions. The novel n-MOSFETs show among the highest electron mobility reported on (100) Ge to-date. Furthermore, these devices provide an excellent Ion/Ioff ratio(4× 103) with very high Ion of 3.23μA/μm. These results show promise towards monolithic integration of Ge MOSFETs with Si CMOS VLSI platform. | en_US |
dc.identifier.doi | 10.1109/IEDM.2009.5424245 | en_US |
dc.identifier.issn | 0163-1918 | en_US |
dc.identifier.uri | http://hdl.handle.net/11693/28653 | |
dc.language.iso | English | en_US |
dc.publisher | IEEE | en_US |
dc.relation.isversionof | http://dx.doi.org/10.1109/IEDM.2009.5424245 | en_US |
dc.source.title | Proceedings of the 2009 IEEE International Electron Devices Meeting, IEDM 2009 | en_US |
dc.subject | Heteroepitaxy | en_US |
dc.subject | High quality single crystals | en_US |
dc.subject | In-situ doping | en_US |
dc.subject | Monolithic integration | en_US |
dc.subject | nMOSFETs | en_US |
dc.subject | Raised source/drain | en_US |
dc.subject | Series resistances | en_US |
dc.subject | Si CMOS | en_US |
dc.subject | Source and drains | en_US |
dc.subject | Source/drain series resistances | en_US |
dc.subject | Electric resistance | en_US |
dc.subject | Electron devices | en_US |
dc.subject | Electron mobility | en_US |
dc.subject | Epitaxial growth | en_US |
dc.subject | Germanium | en_US |
dc.subject | Monolithic integrated circuits | en_US |
dc.subject | Semiconducting silicon compounds | en_US |
dc.subject | Silicon | en_US |
dc.subject | Single crystals | en_US |
dc.subject | MOSFET devices | en_US |
dc.title | High performance n-MOSFETs with novel source/drain on selectively grown Ge on Si for monolithic integration | en_US |
dc.type | Conference Paper | en_US |
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