Atomic Layer Deposition for Vertically Integrated ZnO Thin Film Transistors: Toward 3D High Packing Density Thin Film Electronics

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buir.contributor.authorOkyay, Ali Kemal
dc.citation.issueNumber9
dc.citation.volumeNumber14
dc.contributor.authorSisman, Z.
dc.contributor.authorBolat, S.
dc.contributor.authorOkyay, Ali Kemal
dc.date.accessioned2018-04-12T10:38:28Z
dc.date.available2018-04-12T10:38:28Z
dc.date.issued2017
dc.departmentDepartment of Electrical and Electronics Engineering
dc.departmentInstitute of Materials Science and Nanotechnology (UNAM)
dc.description.abstractWe report on the first demonstration of the atomic layer deposition (ALD) based three dimensional (3D) integrated ZnO thin film transistors (TFTs) on rigid substrates. Devices exhibit high on-off ratio (∼106) and high effective mobility (∼11.8 cm2 V−1 s−1). It has also been demonstrated that the steps of fabrication result in readily stable electrical characteristics in TFTs, eliminating the need for post-production steps. These results mark the potential of our fabrication method for the semiconducting metal oxide-based vertical-integrated circuits requiring high packing density and high functionality. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
dc.embargo.release2018-09-18
dc.identifier.doi10.1002/pssc.201700128
dc.identifier.issn1862-6351
dc.identifier.urihttp://hdl.handle.net/11693/36395
dc.language.isoEnglish
dc.publisherWiley-VCH Verlag
dc.relation.isversionofhttps://doi.org/10.1002/pssc.201700128
dc.source.titlePhysica Status Solidi (C) Current Topics in Solid State Physics
dc.subject3D integration
dc.subjectAtomic layer deposition
dc.subjectThin film transistors
dc.subjectAtomic layer deposition
dc.subjectAtoms
dc.subjectDeposition
dc.subjectMetallic films
dc.subjectMetals
dc.subjectOptical films
dc.subjectThin film transistors
dc.subjectThin films
dc.subjectZinc oxide
dc.subject3-D integration
dc.subjectEffective mobilities
dc.subjectElectrical characteristic
dc.subjectFabrication method
dc.subjectHigh packing density
dc.subjectSemi-conducting metal oxides
dc.subjectThin film electronics
dc.subjectThreedimensional (3-d)
dc.subjectThin film circuits
dc.titleAtomic Layer Deposition for Vertically Integrated ZnO Thin Film Transistors: Toward 3D High Packing Density Thin Film Electronics
dc.typeArticle

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