Laser-slicing of silicon with 3D nonlinear laser lithography

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dc.contributor.authorTokel, Onuren_US
dc.contributor.authorTurnalı, Ahmeten_US
dc.contributor.authorÇolakoğlu, T.en_US
dc.contributor.authorİlday, Serimen_US
dc.contributor.authorBorra, M. Z.en_US
dc.contributor.authorPavlov, Ihoren_US
dc.contributor.authorBek, A.en_US
dc.contributor.authorTuran, R.en_US
dc.contributor.authorİlday, Fatih Ömeren_US
dc.coverage.spatialMunich, Germanyen_US
dc.date.accessioned2018-04-12T11:47:28Z
dc.date.available2018-04-12T11:47:28Z
dc.date.issued2017en_US
dc.departmentDepartment of Electrical and Electronics Engineeringen_US
dc.departmentDepartment of Physicsen_US
dc.descriptionDate of Conference: 25-29 June 2017en_US
dc.descriptionConference Name: European Conference on Lasers and Electro-Optics and the European Quantum Electronics Conference, CLEO/Europe - EQEC 2017en_US
dc.description.abstractRecently, we have showed a direct laser writing method that exploits nonlinear interactions to form subsurface modifications in silicon. Here, we use the technique to demonstrate laser-slicing of silicon and its applications.en_US
dc.description.provenanceMade available in DSpace on 2018-04-12T11:47:28Z (GMT). No. of bitstreams: 1 bilkent-research-paper.pdf: 179475 bytes, checksum: ea0bedeb05ac9ccfb983c327e155f0c2 (MD5) Previous issue date: 2017en
dc.identifier.doi10.1109/CLEOE-EQEC.2017.8087259en_US
dc.identifier.urihttp://hdl.handle.net/11693/37672
dc.language.isoEnglishen_US
dc.publisherOSAen_US
dc.relation.isversionofhttps://doi.org/10.1109/CLEOE-EQEC.2017.8087259en_US
dc.source.titleProceedings of the European Conference on Lasers and Electro-Optics and the European Quantum Electronics Conference, CLEO/Europe - EQEC 2017en_US
dc.subjectSiliconen_US
dc.subjectThree-dimensional displaysen_US
dc.subjectLithographyen_US
dc.subjectLaser theoryen_US
dc.subjectPhysicsen_US
dc.titleLaser-slicing of silicon with 3D nonlinear laser lithographyen_US
dc.typeConference Paperen_US

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