Laser-slicing of silicon with 3D nonlinear laser lithography

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dc.contributor.authorTokel, Onur
dc.contributor.authorTurnalı, Ahmet
dc.contributor.authorÇolakoğlu, T.
dc.contributor.authorİlday, Serim
dc.contributor.authorBorra, M. Z.
dc.contributor.authorPavlov, Ihor
dc.contributor.authorBek, A.
dc.contributor.authorTuran, R.
dc.contributor.authorİlday, Fatih Ömer
dc.coverage.spatialMunich, Germany
dc.date.accessioned2018-04-12T11:47:28Z
dc.date.available2018-04-12T11:47:28Z
dc.date.issued2017
dc.departmentDepartment of Electrical and Electronics Engineering
dc.departmentDepartment of Physics
dc.description.abstractRecently, we have showed a direct laser writing method that exploits nonlinear interactions to form subsurface modifications in silicon. Here, we use the technique to demonstrate laser-slicing of silicon and its applications.
dc.identifier.doi10.1109/CLEOE-EQEC.2017.8087259
dc.identifier.urihttp://hdl.handle.net/11693/37672
dc.language.isoEnglish
dc.publisherOSA
dc.relation.isversionofhttps://doi.org/10.1109/CLEOE-EQEC.2017.8087259
dc.source.titleProceedings of the European Conference on Lasers and Electro-Optics and the European Quantum Electronics Conference, CLEO/Europe - EQEC 2017
dc.subjectSilicon
dc.subjectThree-dimensional displays
dc.subjectLithography
dc.subjectLaser theory
dc.subjectPhysics
dc.titleLaser-slicing of silicon with 3D nonlinear laser lithography
dc.typeConference Paper

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