Mic-in-CMOS: CMUT as a sealed-gap capacitive microphone

buir.contributor.orcidAtalar, Abdullah|0000-0002-1903-1240en_US
dc.contributor.authorKöymen, Hayrettin
dc.contributor.authorAhiska, Y.
dc.contributor.authorAtalar, Abdullah
dc.contributor.authorKöymen, I.
dc.contributor.authorTaşdelen, A .Sinan
dc.contributor.authorYılmaz, Mehmet
dc.contributor.bilkentauthorKöymen, Hayrettin
dc.contributor.bilkentauthorAtalar, Abdullah
dc.contributor.bilkentauthorTaşdelen, A .Sinan
dc.contributor.bilkentauthorYılmaz, Mehmet
dc.coverage.spatialLas Vegas, NV, USA, USAen_US
dc.date.accessioned2021-01-28T11:31:25Z
dc.date.available2021-01-28T11:31:25Z
dc.date.issued2020
dc.departmentDepartment of Electrical and Electronics Engineeringen_US
dc.departmentInstitute of Materials Science and Nanotechnology (UNAM)en_US
dc.departmentAcoustics and Underwater Technologies Research Center (BASTA)en_US
dc.descriptionDate of Conference: 7-11 September 2020en_US
dc.descriptionConference name: 2020 IEEE International Ultrasonics Symposium, IUS 2020en_US
dc.description.abstractThe design and production of a CMOS compatible, watertight and ingress-proof CMUT (capacitive micromachined ultrasonic transducer) microphone, mic-in-CMOS, with vacuum-gap is described. We present an analytical model-based approach for the design of mic-in-CMOS, where a basis for quantitative comparison of performance trade-offs is provided. The sealed vacuum gap of the mic-in-CMOS is basically a lossless sensor, free of mechanical noise. Its SNR is determined by the noise of the pre-amplification electronics (the noise contributor in a CMUT with vacuum gap is essentially the radiation resistance, which is less than 0 dBA for audio band for a 1 mm2 device). The design of mic-in-CMOS involves many multilateral trade-offs such as gap height vs membrane thickness vs sensitivity vs need for linear operation vs bias voltage and atmospheric depression, to name few. The mic-inCMOS design can be mass produced using CMOS film stacks only, as such the fabrication process can be carried out entirely in a CMOS processes production line complemented with CMOS compatible post-processing approaches. Mic-inCMOS has the advantage of low production cost with minimal packaging requirement and on-die EMI / EMC.en_US
dc.identifier.doi10.1109/IUS46767.2020.9251557en_US
dc.identifier.isbn9781728154480
dc.identifier.urihttp://hdl.handle.net/11693/54950
dc.language.isoEnglishen_US
dc.publisherIEEEen_US
dc.relation.isversionofhttps://dx.doi.org/10.1109/IUS46767.2020.9251557en_US
dc.source.titleIEEE International Ultrasonics Symposiumen_US
dc.subjectCapacitive microphoneen_US
dc.subjectSealed gapen_US
dc.subjectMEMSen_US
dc.subjectCMUTen_US
dc.subjectCMOSen_US
dc.titleMic-in-CMOS: CMUT as a sealed-gap capacitive microphoneen_US
dc.typeConference Paperen_US
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