Realistic channel temperature simulation of AlGaN/GaN high electron mobility transistors

Date

2019

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Source Title

2019 European Microwave Conference in Central Europe (EuMCE)

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Publisher

IEEE

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Pages

87 - 90

Language

English

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Abstract

In this work, the realistic channel temperature of AlGaN/GaN High Electron Mobility Transistors (HEMTs) is investigated by using 2D electrothermal and Finite Element Method (FEM) thermal simulations. By using a special method to map the position dependent heating in a device, more accurate results in channel temperature are achieved compared to the conventional FEM methods. With this method, larger device areas can be simulated more accurately with less complexity.

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Keywords

AlGaN/GaN, High-Electron-Mobility-Transistors (HEMT), Reliability, Semiconductor device thermal factors

Citation

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