High performance 3D CMP design with stacked hybrid memory architecture in the dark silicon era using a convex optimization model

dc.citation.epage2610en_US
dc.citation.spage2607en_US
dc.contributor.authorOnsori, Salmanen_US
dc.contributor.authorAsad, Arghavanen_US
dc.contributor.authorRaahemifar, K.en_US
dc.contributor.authorFathy, M.en_US
dc.coverage.spatialMontreal, QC, Canada
dc.date.accessioned2018-04-12T11:49:07Z
dc.date.available2018-04-12T11:49:07Z
dc.date.issued2016-05en_US
dc.departmentDepartment of Computer Engineeringen_US
dc.descriptionDate of Conference: 22-25 May 2016
dc.descriptionConference name: 2016 IEEE International Symposium on Circuits and Systems (ISCAS)
dc.description.abstractIn this article, we present a convex optimization model to design a stacked hybrid memory system to improve performance and reduce energy consumption of the chip-multiprocessor (CMP). Our convex model optimizes numbers and placement of SRAM and STT-RAM memories on the memory layer, and efficiently maps applications/threads on cores in the core layer. Power consumption that is the main challenge in the dark silicon era is represented as a power constraint in this work and it is satisfied by the detailed optimization model in order to design a dark silicon aware 3D CMP. Experimental results show that the proposed architecture considerably improves the energy-delay product (EDP) and performance of the 3D CMP compared to the Baseline memory design. © 2016 IEEE.en_US
dc.description.provenanceMade available in DSpace on 2018-04-12T11:49:07Z (GMT). No. of bitstreams: 1 bilkent-research-paper.pdf: 179475 bytes, checksum: ea0bedeb05ac9ccfb983c327e155f0c2 (MD5) Previous issue date: 2016en
dc.identifier.doi10.1109/ISCAS.2016.7539127en_US
dc.identifier.urihttp://hdl.handle.net/11693/37724en_US
dc.language.isoEnglishen_US
dc.publisherIEEEen_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/ISCAS.2016.7539127en_US
dc.source.titleProceedings - IEEE International Symposium on Circuits and Systems, 2016en_US
dc.subjectConvex-optimizationen_US
dc.subjectDark siliconen_US
dc.subjectEmbedded chip-multiprocessor (eCMP)en_US
dc.subjectHybrid memory architectureen_US
dc.subjectNon-volatile memory (NVM)en_US
dc.subjectPower managementen_US
dc.subjectConvex optimizationen_US
dc.subjectData storage equipmenten_US
dc.subjectDesignen_US
dc.subjectDigital storageen_US
dc.subjectEnergy utilizationen_US
dc.subjectMultiprocessing systemsen_US
dc.subjectOptimizationen_US
dc.subjectPower managementen_US
dc.subjectProduct designen_US
dc.subjectRandom access storageen_US
dc.subjectReconfigurable hardwareen_US
dc.subjectSiliconen_US
dc.subjectStatic random access storageen_US
dc.subjectChip multiprocessorsen_US
dc.subjectDark siliconsen_US
dc.subjectEmbedded chipsen_US
dc.subjectEnergy delay producten_US
dc.subjectNon-volatile memoryen_US
dc.subjectOptimization modelingen_US
dc.subjectProposed architecturesen_US
dc.subjectReduce energy consumptionen_US
dc.subjectMemory architectureen_US
dc.titleHigh performance 3D CMP design with stacked hybrid memory architecture in the dark silicon era using a convex optimization modelen_US
dc.typeConference Paperen_US

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