Conclusions and future outlook

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buir.contributor.authorErdem, Onur
buir.contributor.authorDemir, Hilmi Volkan
buir.contributor.orcidErdem, Onur|0000-0003-2212-965X
buir.contributor.orcidDemir, Hilmi Volkan|0000-0003-1793-112X
dc.citation.epage76en_US
dc.citation.spage73en_US
dc.contributor.authorErdem, Onur
dc.contributor.authorDemir, Hilmi Volkan
dc.date.accessioned2023-02-16T11:46:04Z
dc.date.available2023-02-16T11:46:04Z
dc.date.issued2022-10-28
dc.departmentDepartment of Electrical and Electronics Engineeringen_US
dc.departmentDepartment of Physicsen_US
dc.departmentInstitute of Materials Science and Nanotechnology (UNAM)en_US
dc.descriptionWe summarize our report and briefly review the properties of self-assembled NPLs in each orientation that can be useful for optoelectronic applications. We finalize with prospects and possible future directions that can be investigated with the liquid air interface NPL self-assembly.en_US
dc.description.provenanceSubmitted by Evrim Ergin (eergin@bilkent.edu.tr) on 2023-02-16T11:46:04Z No. of bitstreams: 1 Conclusions_and_future_outlook.pdf: 205710 bytes, checksum: f4e42d8732d7b95c18bab403ffa1bfa6 (MD5)en
dc.description.provenanceMade available in DSpace on 2023-02-16T11:46:04Z (GMT). No. of bitstreams: 1 Conclusions_and_future_outlook.pdf: 205710 bytes, checksum: f4e42d8732d7b95c18bab403ffa1bfa6 (MD5) Previous issue date: 2022-10-28en
dc.identifier.doi10.1007/978-981-19-7052-8_6en_US
dc.identifier.eisbn978-981-19-7052-8
dc.identifier.isbn978-981-19-7051-1
dc.identifier.urihttp://hdl.handle.net/11693/111453
dc.language.isoEnglishen_US
dc.publisherSpringer Singaporeen_US
dc.relation.ispartofOriented self-assembly of colloidal semiconductor nanoplatelets on liquid interfacesen_US
dc.relation.ispartofseriesSpringerBriefs in Applied Sciences and Technology;
dc.relation.isversionofhttps://doi.org/10.1007/978-981-19-7052-8_6en_US
dc.source.titleOriented self-assembly of colloidal semiconductor nanoplatelets on liquid interfacesen_US
dc.subjectCharge transporten_US
dc.subjectEnergy transferen_US
dc.subjectHeterostructuresen_US
dc.subjectLEDsen_US
dc.subjectVCSELsen_US
dc.titleConclusions and future outlooken_US
dc.typeBook Chapteren_US

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