Thermal conductivity measurements in 2D materials
buir.contributor.author | Kasırga, T. Serkan | |
dc.citation.epage | 17 | en_US |
dc.citation.spage | 11 | en_US |
dc.contributor.author | Kasırga, T. Serkan | |
dc.date.accessioned | 2021-03-04T13:21:55Z | |
dc.date.available | 2021-03-04T13:21:55Z | |
dc.date.issued | 2020 | |
dc.department | Department of Physics | en_US |
dc.department | Institute of Materials Science and Nanotechnology (UNAM) | en_US |
dc.description | Chapter 2 | en_US |
dc.description.abstract | Measuring the thermal conductivity of materials is a very important field as the continuation of the improvement in modern electronics and optoelectronics heavily depends on the thermal management. Both high thermal conductivity and low thermal conductivity materials are required in the device design. Besides the fields mentioned above, excess heat scavenging via thermoelectric devices is an ever-growing field. Thermoelectric devices performance is determined by the figure of merit Z=S2σκZ=S2σκ where S is the Seebeck coefficient, σσ is the electrical conductivity and κκ is the thermal conductivity. Materials that are good electrical conductors and thermal insulators are needed for efficient thermoelectric devices. | en_US |
dc.description.provenance | Submitted by Zeynep Aykut (zeynepay@bilkent.edu.tr) on 2021-03-04T13:21:55Z No. of bitstreams: 1 Bilkent-research-paper.pdf: 268963 bytes, checksum: ad2e3a30c8172b573b9662390ed2d3cf (MD5) | en |
dc.description.provenance | Made available in DSpace on 2021-03-04T13:21:55Z (GMT). No. of bitstreams: 1 Bilkent-research-paper.pdf: 268963 bytes, checksum: ad2e3a30c8172b573b9662390ed2d3cf (MD5) Previous issue date: 2020 | en |
dc.identifier.doi | 10.1007/978-981-15-5348-6_2 | en_US |
dc.identifier.doi | 10.1007/978-981-15-5348-6 | en_US |
dc.identifier.eisbn | 9789811553486 | |
dc.identifier.isbn | 9789811553479 | |
dc.identifier.issn | 2191-530X | |
dc.identifier.uri | http://hdl.handle.net/11693/75785 | |
dc.language.iso | English | en_US |
dc.publisher | Springer | en_US |
dc.relation.ispartof | Thermal conductivity measurements in atomically thin materials and devices | en_US |
dc.relation.ispartofseries | SpringerBriefs in Applied Sciences and Technology | |
dc.relation.isversionof | https://dx.doi.org/10.1007/978-981-15-5348-6_2 | en_US |
dc.relation.isversionof | https://doi.org/10.1007/978-981-15-5348-6 | en_US |
dc.source.title | SpringerBriefs in Applied Sciences and Technology | en_US |
dc.subject | Thermal conductivity theory | en_US |
dc.subject | Thermal conductivity measurement | en_US |
dc.subject | Methods Raman thermometry | en_US |
dc.subject | Micro-bridge thermometry | en_US |
dc.subject | Time-domain thermoreflectance | en_US |
dc.subject | Bolometric thermal conductivity measurements | en_US |
dc.title | Thermal conductivity measurements in 2D materials | en_US |
dc.type | Book Chapter | en_US |
Files
Original bundle
1 - 1 of 1
Loading...
- Name:
- Thermal_conductivity_measurements_in_2D_materials.pdf
- Size:
- 823.58 KB
- Format:
- Adobe Portable Document Format
- Description:
License bundle
1 - 1 of 1
No Thumbnail Available
- Name:
- license.txt
- Size:
- 1.71 KB
- Format:
- Item-specific license agreed upon to submission
- Description: