Thermal conductivity measurements in 2D materials

buir.contributor.authorKasırga, T. Serkan
dc.citation.epage17en_US
dc.citation.spage11en_US
dc.contributor.authorKasırga, T. Serkan
dc.date.accessioned2021-03-04T13:21:55Z
dc.date.available2021-03-04T13:21:55Z
dc.date.issued2020
dc.departmentDepartment of Physicsen_US
dc.departmentInstitute of Materials Science and Nanotechnology (UNAM)en_US
dc.descriptionChapter 2en_US
dc.description.abstractMeasuring the thermal conductivity of materials is a very important field as the continuation of the improvement in modern electronics and optoelectronics heavily depends on the thermal management. Both high thermal conductivity and low thermal conductivity materials are required in the device design. Besides the fields mentioned above, excess heat scavenging via thermoelectric devices is an ever-growing field. Thermoelectric devices performance is determined by the figure of merit Z=S2σκZ=S2σκ where S is the Seebeck coefficient, σσ is the electrical conductivity and κκ is the thermal conductivity. Materials that are good electrical conductors and thermal insulators are needed for efficient thermoelectric devices.en_US
dc.description.provenanceSubmitted by Zeynep Aykut (zeynepay@bilkent.edu.tr) on 2021-03-04T13:21:55Z No. of bitstreams: 1 Bilkent-research-paper.pdf: 268963 bytes, checksum: ad2e3a30c8172b573b9662390ed2d3cf (MD5)en
dc.description.provenanceMade available in DSpace on 2021-03-04T13:21:55Z (GMT). No. of bitstreams: 1 Bilkent-research-paper.pdf: 268963 bytes, checksum: ad2e3a30c8172b573b9662390ed2d3cf (MD5) Previous issue date: 2020en
dc.identifier.doi10.1007/978-981-15-5348-6_2en_US
dc.identifier.doi10.1007/978-981-15-5348-6en_US
dc.identifier.eisbn9789811553486
dc.identifier.isbn9789811553479
dc.identifier.issn2191-530X
dc.identifier.urihttp://hdl.handle.net/11693/75785
dc.language.isoEnglishen_US
dc.publisherSpringeren_US
dc.relation.ispartofThermal conductivity measurements in atomically thin materials and devicesen_US
dc.relation.ispartofseriesSpringerBriefs in Applied Sciences and Technology
dc.relation.isversionofhttps://dx.doi.org/10.1007/978-981-15-5348-6_2en_US
dc.relation.isversionofhttps://doi.org/10.1007/978-981-15-5348-6en_US
dc.source.titleSpringerBriefs in Applied Sciences and Technologyen_US
dc.subjectThermal conductivity theoryen_US
dc.subjectThermal conductivity measurementen_US
dc.subjectMethods Raman thermometryen_US
dc.subjectMicro-bridge thermometryen_US
dc.subjectTime-domain thermoreflectanceen_US
dc.subjectBolometric thermal conductivity measurementsen_US
dc.titleThermal conductivity measurements in 2D materialsen_US
dc.typeBook Chapteren_US

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