Wafer bonded capacitive micromachined underwater transducers

Date
2009-09
Advisor
Instructor
Source Title
Proceedings - 2009 IEEE International Ultrasonics Symposium
Print ISSN
Electronic ISSN
Publisher
IEEE
Volume
Issue
Pages
976 - 979
Language
English
Type
Conference Paper
Journal Title
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Volume Title
Abstract

In this work we have designed, fabricated and tested CMUTs as underwater transducers. Single CMUT membranes with three different radii and 380 microns of thickness are fabricated for the demonstration of an underwater CMUT element. The active area of the transducer is fabricated on top of a 3″ silicon wafer. The silicon wafer is bonded to a gold electrode coated glass substrate wafer 10 cm in diameter. Thermally grown silicon oxide layer is used as the insulation layer between membrane and substrate electrodes. Electrical contacts and insulation are made by epoxy layers. Single CMUT elements are tested in air and in water. Approximately 40% bandwidth is achieved around 25 KHz with a single underwater CMUT cell. Radiated pressure field due to second harmonic generation when the CMUTs are driven with high sinusoidal voltages is measured. ©2009 IEEE.

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Keywords
Anodic bonding, Capacitive micromachined ultrasonic transducers, Component, Second harmonic generation, Underwater transducers, Active area, Anodic bonding, Capacitive micromachined ultrasonic transducer, Coated glass substrates, Electrical contacts, Epoxy layers, Gold electrodes, Insulation layers, Micromachined, Pressure field, Silicon oxide layers, Sinusoidal voltage, Substrate electrodes, Underwater transducers, Fabrication, Gold coatings, Harmonic analysis, Harmonic generation, Nonlinear optics, Semiconducting silicon compounds, Silicon oxides, Silicon wafers, Substrates, Transducers, Ultrasonic equipment, Ultrasonic measurement, Ultrasonic waves, Ultrasonics, Wafer bonding, Ultrasonic transducers
Citation
Published Version (Please cite this version)