Current transport mechanisms in plasma-enhanced atomic layer deposited AlN thin films
buir.contributor.author | Bıyıklı, Necmi | |
dc.citation.epage | 155101-6 | en_US |
dc.citation.issueNumber | 15 | en_US |
dc.citation.spage | 155101 | en_US |
dc.citation.volumeNumber | 117 | en_US |
dc.contributor.author | Altuntas, H. | en_US |
dc.contributor.author | Ozgit Akgun, C. | en_US |
dc.contributor.author | Donmez, I. | en_US |
dc.contributor.author | Bıyıklı, Necmi | en_US |
dc.date.accessioned | 2016-02-08T10:12:22Z | |
dc.date.available | 2016-02-08T10:12:22Z | |
dc.date.issued | 2015 | en_US |
dc.department | Institute of Materials Science and Nanotechnology (UNAM) | en_US |
dc.department | Nanotechnology Research Center (NANOTAM) | en_US |
dc.description.abstract | Here, we report on the current transport mechanisms in AlN thin films deposited at a low temperature (i.e., 200°C) on p-type Si substrates by plasma-enhanced atomic layer deposition. Structural characterization of the deposited AlN was carried out using grazing-incidence X-ray diffraction, revealing polycrystalline films with a wurtzite (hexagonal) structure. Al/AlN/ p-Si metal-insulator-semiconductor (MIS) capacitor structures were fabricated and investigated under negative bias by performing current-voltage measurements. As a function of the applied electric field, different types of current transport mechanisms were observed; i.e., ohmic conduction (15.2-21.5 MV/m), Schottky emission (23.6-39.5 MV/m), Frenkel-Poole emission (63.8-211.8 MV/m), trap-assisted tunneling (226-280 MV/m), and Fowler-Nordheim tunneling (290-447 MV/m). Electrical properties of the insulating AlN layer and the fabricated Al/AlN/p-Si MIS capacitor structure such as dielectric constant, flat-band voltage, effective charge density, and threshold voltage were also determined from the capacitance-voltage measurements. | en_US |
dc.description.provenance | Made available in DSpace on 2016-02-08T10:12:22Z (GMT). No. of bitstreams: 1 bilkent-research-paper.pdf: 70227 bytes, checksum: 26e812c6f5156f83f0e77b261a471b5a (MD5) Previous issue date: 2015 | en_US |
dc.identifier.doi | 10.1063/1.4917567 | en_US |
dc.identifier.issn | 0021-8979 | |
dc.identifier.uri | http://hdl.handle.net/11693/23336 | |
dc.language.iso | English | en_US |
dc.publisher | A I P Publishing LLC | en_US |
dc.relation.isversionof | http://dx.doi.org/10.1063/1.4917567 | en_US |
dc.source.title | Journal of Applied Physics | en_US |
dc.subject | Aluminum | en_US |
dc.subject | Atomic layer deposition | en_US |
dc.subject | Capacitors | en_US |
dc.subject | Electric fields | en_US |
dc.subject | Metal insulator boundaries | en_US |
dc.subject | MIS devices | en_US |
dc.subject | MOS capacitors | en_US |
dc.subject | Semiconducting silicon | en_US |
dc.subject | Silicon | en_US |
dc.subject | Temperature | en_US |
dc.subject | Thin films | en_US |
dc.subject | Threshold voltage | en_US |
dc.subject | Voltage measurement | en_US |
dc.subject | X ray diffraction | en_US |
dc.subject | Zinc sulfide | en_US |
dc.subject | Capacitance voltage measurements | en_US |
dc.subject | Current transport mechanism | en_US |
dc.subject | Current voltage measurement | en_US |
dc.subject | Grazing incidence X-ray diffraction | en_US |
dc.subject | Metal insulator semiconductor capacitors | en_US |
dc.subject | Plasma-enhanced atomic layer deposition | en_US |
dc.subject | Structural characterization | en_US |
dc.subject | Trap assisted tunneling | en_US |
dc.subject | Deposition | en_US |
dc.title | Current transport mechanisms in plasma-enhanced atomic layer deposited AlN thin films | en_US |
dc.type | Article | en_US |
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