Integration of through-wafer interconnects with a two-dimensional cantilever array
Sensors and Actuators A: Physical
118 - 123
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High-density through-wafer interconnects are incorporated in a two-dimensional (2D) micromachined cantilever array. The design addresses alignment and density issues associated with 2D arrays. Each cantilever has piezoresistive deflection sensors and high-aspect ratio silicon tips. The fabrication process and array operation are described. The integration of cantilevers, tips, and interconnects enables operation of a high-density 2D scanning probe array over large areas.
Scanning probe microscope
Through-wafer electrical ınterconnect
Piezoresistive silicon cantilever