Integration of through-wafer interconnects with a two-dimensional cantilever array
Chow, E. M.
Soh, H. T.
Lee, H. C.
Adams, J. D.
Minne, S. C.
Yaralioglu, G. G.
Quate, C. F.
Kenny, T. W.
Sensors and Actuators A: Physical
Chow, E. M., Soh, H. T., Lee, H. C., Adams, J. D., Minne, S. C., Yaralioglu, G., ... & Kenny, T. W. (2000). Integration of through-wafer interconnects with a two-dimensional cantilever array. Sensors and Actuators A: Physical, 83(1), 118-123.
Please cite this item using this persistent URLhttp://hdl.handle.net/11693/13505
High-density through-wafer interconnects are incorporated in a two-dimensional (2D) micromachined cantilever array. The design addresses alignment and density issues associated with 2D arrays. Each cantilever has piezoresistive deflection sensors and high-aspect ratio silicon tips. The fabrication process and array operation are described. The integration of cantilevers, tips, and interconnects enables operation of a high-density 2D scanning probe array over large areas. (C) 2000 Elsevier Science S.A. All rights reserved.