Integration of through-wafer interconnects with a two-dimensional cantilever array
| buir.contributor.orcid | Atalar, Abdullah|0000-0002-1903-1240 | |
| dc.citation.epage | 123 | en_US |
| dc.citation.issueNumber | 1-3 | en_US |
| dc.citation.spage | 118 | en_US |
| dc.citation.volumeNumber | 83 | en_US |
| dc.contributor.author | Chow, E. M. | en_US |
| dc.contributor.author | Soh, H. T. | en_US |
| dc.contributor.author | Lee, H. C. | en_US |
| dc.contributor.author | Adams, J. D. | en_US |
| dc.contributor.author | Minne, S. C. | en_US |
| dc.contributor.author | Yaralioglu, G. G. | en_US |
| dc.contributor.author | Atalar, Abdullah | en_US |
| dc.contributor.author | Quate, C. F. | en_US |
| dc.contributor.author | Kenny, T. W. | en_US |
| dc.date.accessioned | 2015-07-28T12:06:39Z | |
| dc.date.available | 2015-07-28T12:06:39Z | |
| dc.date.issued | 2000-05-22 | en_US |
| dc.department | Department of Electrical and Electronics Engineering | en_US |
| dc.description.abstract | High-density through-wafer interconnects are incorporated in a two-dimensional (2D) micromachined cantilever array. The design addresses alignment and density issues associated with 2D arrays. Each cantilever has piezoresistive deflection sensors and high-aspect ratio silicon tips. The fabrication process and array operation are described. The integration of cantilevers, tips, and interconnects enables operation of a high-density 2D scanning probe array over large areas. | en_US |
| dc.identifier.doi | 10.1016/S0924-4247(99)00381-7 | en_US |
| dc.identifier.issn | 0924-4247 | |
| dc.identifier.uri | http://hdl.handle.net/11693/13505 | |
| dc.language.iso | English | en_US |
| dc.publisher | Elsevier | en_US |
| dc.relation.isversionof | http://dx.doi.org/10.1016/S0924-4247(99)00381-7 | en_US |
| dc.source.title | Sensors and Actuators A: Physical | en_US |
| dc.subject | Sensor Array | en_US |
| dc.subject | Scanning probe microscope | en_US |
| dc.subject | Through-wafer electrical ınterconnect | en_US |
| dc.subject | Piezoresistive silicon cantilever | en_US |
| dc.title | Integration of through-wafer interconnects with a two-dimensional cantilever array | en_US |
| dc.type | Article | en_US |
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