Batch-compatible micromanufacturing of a CMUT array for optoacoustic imaging of tissue-like phantoms

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buir.advisorYılmaz, Mehmet
dc.contributor.authorÖzyiğit, Doğu Kaan Buğra
dc.date.accessioned2021-08-31T11:09:11Z
dc.date.available2021-08-31T11:09:11Z
dc.date.copyright2021-08
dc.date.issued2021-08
dc.date.submitted2021-08-27
dc.departmentGraduate Program in Materials Science and Nanotechnologyen_US
dc.descriptionCataloged from PDF version of article.en_US
dc.descriptionThesis (Master's): Bilkent University, Department of Materials Science and Nanotechnology, İhsan Doğramacı Bilkent University, 2021.en_US
dc.descriptionIncludes bibliographical references (leaves 78-86).en_US
dc.description.abstractPhotoacoustic imaging (PAI), also named optoacoustic imaging, is a technol-ogy for medical imaging that relies on contrast data due to optical stimulation. Capacitive micromachined ultrasound transducers (CMUTs) are previously in-troduced for PAI applications. In this thesis, the provided CMUT array design has been partially micro-manufactured separately from electronics and a laser fiber light source while re-serving the necessary chip space for integration with electronics and laser fiber light source. Batch compatible wafer-scale microfabrication of CMUT arrays was done by a combination of novel as well as traditional MEMS microfabrication pro-cesses. CMUT array gaps, bottom electrodes, and insulation layer were formed on the Pyrex wafer using three separate photolithography masks. Anodic wafer bonding method is used for the formation of the top electrodes and top side of the gap heights of CMUT arrays. Process development for anodic wafer bonding between Pyrex wafers and SOI wafers has been done, where the Pyrex wafers have been previously processed with plasma etching, wet etching, metal stack de-position, insulation layer deposition, and insulation layer patterning, while SOI wafers have been used as received. Pyrex wafers and SOI wafers were anodically bonded to each other with developed anodic wafer bonding processes. After full completion of the micromanufacturing of the CMUT array chips, these CMUT ar-ray chips will be integrated with ASIC chips. Then, CMUT array chips and ASIC chips will be combined with a traditional printed circuit board (PCB). These in-tegrated CMUT array chips, ASIC chips, and PCB are going to be integrated with a fiber laser light source inside a mechanically robust hand-held probe that is planned to be used for optoacoustic imaging. The main goal of this CMUT array micromanufacturing study is to significantly contribute to the development of one of the necessary components for imaging of a tissue like-phantom using a hand-held imaging probe.en_US
dc.description.degreeM.S.en_US
dc.description.statementofresponsibilityby Doğu Kaan Buğra Özyiğiten_US
dc.embargo.release2022-02-26
dc.format.extentxvii, 86 leaves : illustrations (color) ; 30 cm.en_US
dc.identifier.itemidB133404
dc.identifier.urihttp://hdl.handle.net/11693/76484
dc.language.isoEnglishen_US
dc.publisherBilkent Universityen_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.subjectCapacitive micromachined ultrasonic transducersen_US
dc.subjectMicrofabricationen_US
dc.subjectCMUTen_US
dc.subjectMEMSen_US
dc.subjectArrayen_US
dc.subjectOptoacoustic imagingen_US
dc.subjectPhotoacoustic imagingen_US
dc.subjectAnodic wafer bondingen_US
dc.titleBatch-compatible micromanufacturing of a CMUT array for optoacoustic imaging of tissue-like phantomsen_US
dc.title.alternativeDoku benzer fantomlarn optoakustik Görüntülenmesi için CMUT dizilerinin toplu mikro üretimien_US
dc.typeThesisen_US

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