Injection molding of polymeric microfluidic devices

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buir.advisorÇetin, Barbaros
dc.contributor.authorKoska, Arif Koray
dc.date.accessioned2016-01-08T18:22:06Z
dc.date.available2016-01-08T18:22:06Z
dc.date.issued2013
dc.departmentDepartment of Mechanical Engineeringen_US
dc.descriptionAnkara : The Department of Mechanical Engineeringsand the Graduate School of Engineering and Science of Bilkent University, 2013.en_US
dc.descriptionThesis (Master's) -- Bilkent University, 2013.en_US
dc.descriptionIncludes bibliographical references.en_US
dc.description.abstractMass-production of microfluidic devices is important for fields in which disposable devices are widely used such as clinical diagnostic and biotechnology. Injection molding is a well-known, promising process for the production of devices on a mass-scale at low-cost. The major objective of this study is to develop a technique for repeatable, productive and accurate fabrication of integrated microfluidic devices on a mass production scale. To achieve this, injection molding process is adapted for the fabrication of a microfluidic device with a single microchannel. During the design procedure, numerical experimentation was performed using Moldflow® simulation tool. To increase the product quality, high-precision mechanical machining is utilized for the manufacturing of the mold of the microfluidic device. A conventional injection molding machine is implemented for the injection molding process of the microfluidic device. Injection molding is performed at different mold temperatures. The warpage of the injected pieces is characterized by measuring the part deformation. The effect of the mold temperature on the quality of the final device is assessed in terms of part deformation and the bonding quality. From the experimental results, one-to-one correspondence between the warpage and the bonding quality of the molded pieces is observed. As the warpage of the pieces decresases, the bonding quality increases. A maximum point for the breaking pressure of the bonding and the minimum point for the warpage was found at the same mold temperature. This mold temperature was named as the optimum temperature for designed microfluidic device. The experimental results are also used to discuss the assessment of the simulation results. It was observed that although Moldflow® can predict many aspects of the process, all the physics of the injection molding process cannot be covered.en_US
dc.description.degreeM.S.en_US
dc.description.statementofresponsibilityKoska, Arif Korayen_US
dc.format.extentxiii, 97 leaves, illustrations, graphicsen_US
dc.identifier.urihttp://hdl.handle.net/11693/15651
dc.language.isoEnglishen_US
dc.publisherBilkent Universityen_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.subjectPolymeric disposable devicesen_US
dc.subjectmicrofluidicsen_US
dc.subjectinjection moldingen_US
dc.subjectwarpage characterizationen_US
dc.subjectdirect bondingen_US
dc.subject.lccTJ853.4.M53 K67 2013en_US
dc.subject.lcshMicrofluidic devices.en_US
dc.subject.lcshMicrofluidics.en_US
dc.subject.lcshPolymers--Microstructure.en_US
dc.subject.lcshDisposable medical devices.en_US
dc.subject.lcshInjection molding of plastics.en_US
dc.titleInjection molding of polymeric microfluidic devicesen_US
dc.typeThesisen_US

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