Feasibility of electrical-contact free measurement of the response of superconductive bolometer arrays using the thermal crosstalk

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dc.citation.epage1293en_US
dc.citation.issueNumber1en_US
dc.citation.spage1290en_US
dc.citation.volumeNumber43en_US
dc.contributor.authorBozbey, A.en_US
dc.contributor.authorFardmanesh, M.en_US
dc.contributor.authorSchubert J.en_US
dc.contributor.authorBanzet, M.en_US
dc.date.accessioned2016-02-08T10:19:17Z
dc.date.available2016-02-08T10:19:17Z
dc.date.issued2006en_US
dc.departmentDepartment of Electrical and Electronics Engineeringen_US
dc.description.abstractWe utilized and investigated the unique dependence of the magnitude and phase of the response on the thermal crosstalk between bolometer pixels in an array to measure the response of the devices through fewer monitoring devices. In this study, we show the feasibility of the proposed read-out technique by use of two source pixels in an array, as the image-mapping devices, and one optically shielded pixel as the read-out device. While the sense pixels were electrical-contact free, the read-out device was current biased in 4-probe current-bias configuration. Both the phase and magnitude of the response due to the crosstalk in the array were found to be strongly dependent on the modulation frequency and the distance between the sense and read-out pixels. A series of measurements were designed to extract the response of each single sense-pixel. By combining the measured data, the response of individual pixels could be extracted through the interpolation of the mapped responses. © 2006 IOP Publishing Ltd.en_US
dc.description.provenanceMade available in DSpace on 2016-02-08T10:19:17Z (GMT). No. of bitstreams: 1 bilkent-research-paper.pdf: 70227 bytes, checksum: 26e812c6f5156f83f0e77b261a471b5a (MD5) Previous issue date: 2006en
dc.identifier.doi10.1088/1742-6596/43/1/315en_US
dc.identifier.issn17426588
dc.identifier.urihttp://hdl.handle.net/11693/23793
dc.language.isoEnglishen_US
dc.relation.isversionofhttp://dx.doi.org/10.1088/1742-6596/43/1/315en_US
dc.source.titleJournal of Physics: Conference Seriesen_US
dc.titleFeasibility of electrical-contact free measurement of the response of superconductive bolometer arrays using the thermal crosstalken_US
dc.typeArticleen_US

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