Bandwidth, power and noise considerations in airborne cMUTs

buir.contributor.authorAtalar, Abdullah
buir.contributor.authorKöymen, Hayrettin
buir.contributor.orcidAtalar, Abdullah|0000-0002-1903-1240
dc.citation.epage441en_US
dc.citation.spage438en_US
dc.contributor.authorŞenlik, Muhammed N.en_US
dc.contributor.authorOlcum, Selimen_US
dc.contributor.authorKöymen, Hayrettinen_US
dc.contributor.authorAtalar, Abdullahen_US
dc.coverage.spatialRome, Italy
dc.date.accessioned2016-02-08T12:25:39Z
dc.date.available2016-02-08T12:25:39Z
dc.date.issued2009-09en_US
dc.departmentDepartment of Electrical and Electronics Engineeringen_US
dc.descriptionDate of Conference: 20-23 Sept. 2009
dc.descriptionConference name: 2009 IEEE International Ultrasonics Symposium
dc.description.abstractCapacitive micromachined ultrasonic transducers (cMUTs) offer wider bandwidth in air due to their low mechanical impedances. The impedance mismatch between the air and transducer decreases with the smaller device dimensions increasing the bandwidth at the expense of the degradation in the transmit power and the receive sensitivity. In this work, the bandwidth of cMUT is optimized by increasing its radiation resistance. This is done by properly choosing the size of cMUT membranes and their placement within an array. This selection not only brings an improvement in the transmitted power when it is used as a transmitter, but also improves the noise figure when it is used as a receiver. A further improvement in the noise figure is possible when the cells are clustered and connected to separate receivers. ©2009 IEEE.en_US
dc.description.provenanceMade available in DSpace on 2016-02-08T12:25:39Z (GMT). No. of bitstreams: 1 bilkent-research-paper.pdf: 70227 bytes, checksum: 26e812c6f5156f83f0e77b261a471b5a (MD5) Previous issue date: 2009en
dc.identifier.doi10.1109/ULTSYM.2009.5441775en_US
dc.identifier.issn1051-0117
dc.identifier.urihttp://hdl.handle.net/11693/28632
dc.language.isoEnglishen_US
dc.publisherIEEE
dc.relation.isversionofhttp://dx.doi.org/10.1109/ULTSYM.2009.5441775en_US
dc.source.title2009 IEEE International Ultrasonics Symposium - Proceedingsen_US
dc.subjectCapacitive micromachined ultrasonic transduceren_US
dc.subjectImpedance mismatchen_US
dc.subjectMechanical impedancesen_US
dc.subjectRadiation resistanceen_US
dc.subjectTransmit poweren_US
dc.subjectTransmitted poweren_US
dc.subjectBandwidthen_US
dc.subjectNoise figureen_US
dc.subjectTransducersen_US
dc.subjectUltrasonicsen_US
dc.subjectUltrasonic transducersen_US
dc.titleBandwidth, power and noise considerations in airborne cMUTsen_US
dc.typeConference Paperen_US

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