Electrical-contact-free readout of the response of superconductive bolometer arrays using thermal cross talk

We utilized and investigated the unique dependence of the magnitude and phase of the response on thermal cross talk between bolometer pixels in an array to measure the response of the devices through fewer monitoring devices. We show the feasibility of the proposed readout technique by use of two source pixels in an array, as the image-mapping devices, and one optically shielded pixel as the readout device. While the sensing pixels were electrical-contact free, the readout device was current biased in 4-probe current-bias configuration. Both the phase and the magnitude of the response due to the cross talk in the array were found to be strongly dependent on the modulation frequency and the distance between the sensing and the readout pixels. A series of measurements were designed to extract the response of each single-sensing pixel. By combining the measured data, the response of individual pixels could be extracted through the interpolation of the mapped responses.