On-Chip integration of functional hybrid materials and components in nanophotonics and optoelectronics
buir.contributor.orcid | Demir, Hilmi Volkan|0000-0003-1793-112X | |
dc.citation.epage | 391 | en_US |
dc.citation.spage | 339 | en_US |
dc.contributor.author | Erdem, Talha | en_US |
dc.contributor.author | Demir, Hilmi Volkan | en_US |
dc.contributor.editor | Singh, M. | |
dc.contributor.editor | Ohji, T. | |
dc.contributor.editor | Asthana, R. | |
dc.contributor.editor | Mathur, S. | |
dc.date.accessioned | 2018-04-12T13:50:28Z | |
dc.date.available | 2018-04-12T13:50:28Z | |
dc.date.issued | 2011 | en_US |
dc.department | Department of Electrical and Electronics Engineering | en_US |
dc.department | Department of Physics | en_US |
dc.description | Chapter 12 | en_US |
dc.description.abstract | Incorporation of custom - designed nanomaterial into nanophotonic devices and components in optoelectronic systems enables the realization of optical functionalities favorably controlled with external optical and electrical effects. To this end, innovative nanophotonic devices and optoelectronic systems are developed using multiple combinations of nanostructures (epitaxially grown, chemically synthesized, deposited, plated, etc.) that are embedded in hybrid architectures and on - chip integration of components for a variety of applications including light generation, displays, modulation, sensing, imaging, and communications in a wide spectral range from ultraviolet (UV) to visible to infrared. | en_US |
dc.description.provenance | Made available in DSpace on 2018-04-12T13:50:28Z (GMT). No. of bitstreams: 1 bilkent-research-paper.pdf: 179475 bytes, checksum: ea0bedeb05ac9ccfb983c327e155f0c2 (MD5) Previous issue date: 2011 | en |
dc.identifier.doi | 10.1002/9781118056776.ch12 | en_US |
dc.identifier.doi | 10.1002/9781118056776 | en_US |
dc.identifier.eisbn | 9781118056776 | en_US |
dc.identifier.isbn | 9780470391228 | en_US |
dc.identifier.uri | http://hdl.handle.net/11693/38193 | en_US |
dc.language.iso | English | en_US |
dc.publisher | John Wiley & Sons | en_US |
dc.relation.ispartof | Ceramic integration and joining technologies: from macro to nanoscale | en_US |
dc.relation.isversionof | https://doi.org/10.1002/9781118056776.ch12 | en_US |
dc.subject | General self-assembly | en_US |
dc.subject | Hybrid | en_US |
dc.subject | Nanoskyving | en_US |
dc.subject | On-chip integration | en_US |
dc.title | On-Chip integration of functional hybrid materials and components in nanophotonics and optoelectronics | en_US |
dc.type | Book Chapter | en_US |
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