Integration of through-wafer interconnects with a two-dimensional cantilever array

Abstract

High-density through-wafer interconnects are incorporated in a two-dimensional (2D) micromachined cantilever array. The design addresses alignment and density issues associated with 2D arrays. Each cantilever has piezoresistive deflection sensors and high-aspect ratio silicon tips. The fabrication process and array operation are described. The integration of cantilevers, tips, and interconnects enables operation of a high-density 2D scanning probe array over large areas.