High Power CMUTs: design and experimental verification

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buir.contributor.authorAtalar, Abdullah
buir.contributor.authorKöymen, Hayrettin
buir.contributor.orcidAtalar, Abdullah|0000-0002-1903-1240
dc.citation.epage1284en_US
dc.citation.issueNumber6en_US
dc.citation.spage1276en_US
dc.citation.volumeNumber59en_US
dc.contributor.authorYamaner, F. Y.en_US
dc.contributor.authorOlcum, S.en_US
dc.contributor.authorOguz, H. K.en_US
dc.contributor.authorBozkurt, A.en_US
dc.contributor.authorKöymen, Hayrettinen_US
dc.contributor.authorAtalar, Abdullahen_US
dc.date.accessioned2015-07-28T12:05:21Z
dc.date.available2015-07-28T12:05:21Z
dc.date.issued2012en_US
dc.departmentDepartment of Electrical and Electronics Engineeringen_US
dc.description.abstractCapacitive micromachined ultrasonic transducers (CMUTs) have great potential to compete with piezoelectric transducers in high-power applications. As the output pressures increase, nonlinearity of CMUT must be reconsidered and optimization is required to reduce harmonic distortions. In this paper, we describe a design approach in which uncollapsed CMUT array elements are sized so as to operate at the maximum radiation impedance and have gap heights such that the generated electrostatic force can sustain a plate displacement with full swing at the given drive amplitude. The proposed design enables high output pressures and low harmonic distortions at the output. An equivalent circuit model of the array is used that accurately simulates the uncollapsed mode of operation. The model facilities the design of CMUT parameters for high-pressure output, without the intensive need for computationally involved FEM tools. The optimized design requires a relatively thick plate compared with a conventional CMUT plate. Thus, we used a silicon wafer as the CMUT plate. The fabrication process involves an anodic bonding process for bonding the silicon plate with the glass substrate. To eliminate the bias voltage, which may cause charging problems, the CMUT array is driven with large continuous wave signals at half of the resonant frequency. The fabricated arrays are tested in an oil tank by applying a 125-V peak 5-cycle burst sinusoidal signal at 1.44 MHz. The applied voltage is increased until the plate is about to touch the bottom electrode to get the maximum peak displacement. The observed pressure is about 1.8 MPa with −28 dBc second harmonic at the surface of the array.en_US
dc.description.provenanceMade available in DSpace on 2015-07-28T12:05:21Z (GMT). No. of bitstreams: 1 10.1109-TUFFC.2012.2318.pdf: 1215428 bytes, checksum: 023b823435e3a43fa095e05952367b87 (MD5)en
dc.identifier.doi10.1109/TUFFC.2012.2318en_US
dc.identifier.issn0885-3010
dc.identifier.urihttp://hdl.handle.net/11693/13245
dc.language.isoEnglishen_US
dc.publisherIEEEen_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/TUFFC.2012.2318en_US
dc.source.titleIEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Controlen_US
dc.subjectMicromachined ultrasonic transducersen_US
dc.subjectDual-electrode structureen_US
dc.subjectReceive performanceen_US
dc.subjectRadiation impedanceen_US
dc.subjectImproved transmiten_US
dc.subjectArrayen_US
dc.subjectFeasibilityen_US
dc.subjectOperationen_US
dc.subjectMembranesen_US
dc.subjectCircuiten_US
dc.titleHigh Power CMUTs: design and experimental verificationen_US
dc.typeArticleen_US

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