Three dimensional processing of silicon with pulsed lasers for optical applications

buir.advisorİlday, F. Ömer
dc.contributor.authorTurnalı, Ahmet
dc.date.accessioned2016-05-02T07:45:03Z
dc.date.available2016-05-02T07:45:03Z
dc.date.copyright2015-05
dc.date.issued2015-05
dc.date.submitted11-06-2015
dc.departmentDepartment of Electrical and Electronics Engineeringen_US
dc.descriptionCataloged from PDF version of thesis.en_US
dc.descriptionIncludes bibliographical references (leaves 44-48).en_US
dc.descriptionThesis (Master's): Bilkent University, Department of Electrical and Electronics Engineering, İhsan Doğramacı Bilkent University, 2015.en_US
dc.description.abstractMicromachining of silicon with lasers is being investigated for the last three decades. Until now, interior silicon modification without inscribing the surface has not resulted in success. Such an ability could enable disruptive technologies in nanophotonics by paving the way for producing monolithic optoelectronic chips. Here, we report a maskless, one step photo-induced method to generate subsurface modifications in silicon with pulsed infrared lasers for indefinitely large areas. We demonstrate continuous, highly controllable structures buried in the bulk of silicon wafers and investigate the underlying mechanism. Further, we utilize the method for spatial information encoding and fabrication of optical components in the infrared regime in silicon. This silicon processing technology can be useful in various applications, including multilayer silicon chips, solar cells and opto uidics.en_US
dc.description.degreeM.S.en_US
dc.description.statementofresponsibilityby Ahmet Turnalıen_US
dc.embargo.release2017-06-05
dc.format.extentxii, 48 leaves : illustrations, charts.en_US
dc.identifier.itemidB150332
dc.identifier.urihttp://hdl.handle.net/11693/29023
dc.language.isoEnglishen_US
dc.publisherBilkent Universityen_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.subjectSiliconen_US
dc.subjectSubsurfaceen_US
dc.subjectThree dimensionalen_US
dc.subjectLaseren_US
dc.subjectProcessingen_US
dc.titleThree dimensional processing of silicon with pulsed lasers for optical applicationsen_US
dc.title.alternativeOptik uygulamalar için silikonun üç boyutlu işlenmesien_US
dc.typeThesisen_US

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