Analytical modelling of the interpixel thermal crosstalk in superconducting edge-transition bolometer arrays

Abstract

We present an analytical thermal model to explain the crosstalk in YBCO edge-transition bolometer arrays. The verification of the model was tested on sample array devices made of 200 and 400 nm YBCO films on LaAlO3 and SrTiO3 substrates. The model presented was able to explain the effects of the various physical parameters of the devices, such as the film thickness, operating temperature, and the device separation, which cause different response behaviours based on the variation of the related thermal crosstalk characteristics. In addition, the model is valid above the crosstalk-free modulation frequencies, where the effects of the thermal crosstalk on the response of the devices are negligible.