Browsing by Subject "Material removal rate"

Filter results by typing the first few letters
Now showing 1 - 2 of 2
  • Thumbnail Image
    ItemOpen Access
    83 W, 1 ns, 3.1 MHz all-fiber laser for micromachining
    (IEEE, 2011) Özgören, Kıvanç; Öktem, Bülent; Yılmaz, Sinem; İlday, F. Ömer; Pasin, E.; Eken, K.
    Fiber lasers are commonly used for various material processing applications. The advantages (such as simplicity of the system, high material removal rate) and disadvantages (larger heat-affected zone, reduced precision) of nanosecond pulses over sub-picosecond pulses are well known. © 2011 IEEE.
  • Thumbnail Image
    ItemOpen Access
    Non-thermal material and tissue processing with 100 MHz and 500 MHz repetition rate bursts
    (IEEE, 2013) Kerse, Can; Kalaycıoğlu, Hamit; Akaalan O.; Eldeniz, Y.B.; İlday, F. Ömer; Hoogland H.; Holzwarth, R.
    There are a number of applications that would avail a pulse pattern in the form of closely grouped and uniformly spaced pulses, i.e., bursts [1]. Closely grouped pulses with pulse to pulse separation in the order of a few nanoseconds have a potential for increasing material removal rates [2] and thereby reducing the thermal effects. Besides, keeping the burst repetition period in the order of thermal relaxation time has the advantage of keeping the overall average power at lower levels in order to prevent the cumulative heating of the material. © 2013 IEEE.