Browsing by Subject "AlGaN/GaN HEMTs"

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Open Access
Energy relaxations of hot electrons in AlGaN/AlN/GaN heterostructures grown by MOCVD on sapphire and 6H-SiC substrates
(E D P Sciences, 2011-08-18) Ilgaz, A.; Gökden, S.; Tülek, R.; Teke, A.; Özçelik, S.; Özbay, Ekmel
In this work, we investigated the hot-electron dynamics of AlGaN/GaN HEMT structures grown by MOCVD on sapphire and SiC substrates at 80 K. High-speed current-voltage measurements and Hall measurements over the temperature range 27-300 K were used to study hot-electron dynamics. At low fields, drift velocity increases linearly, but deviates from the linearity toward high electric fields. Drift velocities are deduced as approximately 6.55 × 10 6 and 6.60 × 106 cm/s at an electric field of around E ∼ 25 kV/cm for samples grown on sapphire and SiC, respectively. To obtain the electron temperature as a function of the applied electric field and power loss as a function of the electron temperature, we used the so-called mobility comparison method with power balance equations. Although their low field carrier transport properties are similar as observed from Hall measurements, hot carrier energy dissipation differs for samples grown on sapphire and SiC substrates. We found that LO-phonon lifetimes are 0.50 ps and 0.32 ps for sapphire and SiC substrates, respectively. A long hot-phonon lifetime results in large non- equilibrium hot phonons. Non-equilibrium hot phonons slow energy relaxation and increase the momentum relaxation. The effective energy relaxation times at high fields are 24 and 65 ps for samples grown on sapphire and SiC substrates, respectively. They increase as the electron temperature decreases.
Open Access
Impact of the low temperature ohmic contact process on DC and forward gate bias stress operation of GaN HEMT devices
(Institute of Electrical and Electronics Engineers, 2022-08-17) Odabaşı, Oğuz; Ghobadi, Amir; Ghobadi, Türkan Gamze Ulusoy; Ünal, Yakup; Salkım, Gurur; Başar, Güneş; Bütün, Bayram; Özbay, Ekmel
In AlGaN/GaN high electron mobility transistors (HEMTs), high temperature processes (such as ohmic annealing with >800°C value) could deform the crystal structure and induce trap states within the bulk and surface. Expanded defect densities cause crucial problems, such as threshold voltage ( Vth ) instability, current collapse, and high leakages. In this work, a low temperature ohmic contact process (630°C, 10 minutes) is adopted with recess etch, and contact resistances <0.1Ω ⋅ mm with low sheet resistances are achieved. The positive impact of this low thermal budget process on surface morphology, DC operation, long-term stability, and forward gate bias stress of the device is studied.