Browsing by Author "Kesim, D. K."

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Open Access
Ablation-cooled material removal with ultrafast bursts of pulses
(Nature Publishing Group, 2016) Kerse C.; Kalaycıoğlu, H.; Elahi, P.; Çetin B.; Kesim, D. K.; Akçaalan, Ö.; Yavaş S.; Aşık, M. D.; Öktem B.; Hoogland H.; Holzwarth, R.; Ilday, F. Ö.
The use of femtosecond laser pulses allows precise and thermal-damage-free removal of material (ablation) with wide-ranging scientific, medical and industrial applications. However, its potential is limited by the low speeds at which material can be removed and the complexity of the associated laser technology. The complexity of the laser design arises from the need to overcome the high pulse energy threshold for efficient ablation. However, the use of more powerful lasers to increase the ablation rate results in unwanted effects such as shielding, saturation and collateral damage from heat accumulation at higher laser powers. Here we circumvent this limitation by exploiting ablation cooling, in analogy to a technique routinely used in aerospace engineering. We apply ultrafast successions (bursts) of laser pulses to ablate the target material before the residual heat deposited by previous pulses diffuses away from the processing region. Proof-of-principle experiments on various substrates demonstrate that extremely high repetition rates, which make ablation cooling possible, reduce the laser pulse energies needed for ablation and increase the efficiency of the removal process by an order of magnitude over previously used laser parameters. We also demonstrate the removal of brain tissue at two cubic millimetres per minute and dentine at three cubic millimetres per minute without any thermal damage to the bulk.
Open Access
All-fiber burst mode laser system integrated with OCT for cataract surgery
(IEEE, 2016) Kesim, D. K.; Kalaycıoğlu, Hamit; Kerse, C.; İlday, Fatih Ömer
We demonstrate a burst-mode Yb all-fiber femtosecond laser system integrated with OCT for cataract surgery and aim to enhance further the procedure with lower collateral tissue damage, cleaner, efficient cuts with compact and robust structure.
Open Access
In-chip microstructures and photonic devices fabricated by nonlinear laser lithography deep inside silicon
(Nature Publishing Group, 2017) Tokel, O.; Turnalı, A.; Makey, G.; Elahi, P.; Çolakoǧlu, T.; Ergeçen E.; Yavuz, Ö.; Hübner R.; Borra, M. Z.; Pavlov, I.; Bek, A.; Turan, R.; Kesim, D. K.; Tozburun, S.; Ilday, S.; Ilday, F. Ö.
Silicon is an excellent material for microelectronics and integrated photonics 1-3, with untapped potential for mid-infrared optics 4 . Despite broad recognition of the importance of the third dimension 5,6, current lithography methods do not allow the fabrication of photonic devices and functional microelements directly inside silicon chips. Even relatively simple curved geometries cannot be realized with techniques like reactive ion etching. Embedded optical elements 7, electronic devices and better electronic-photonic integration are lacking 8 . Here, we demonstrate laser-based fabrication of complex 3D structures deep inside silicon using 1-μm-sized dots and rod-like structures of adjustable length as basic building blocks. The laser-modified Si has an optical index different to that in unmodified parts, enabling the creation of numerous photonic devices. Optionally, these parts can be chemically etched to produce desired 3D shapes. We exemplify a plethora of subsurface - that is, 'in-chip' - microstructures for microfluidic cooling of chips, vias, micro-electro-mechanical systems, photovoltaic applications and photonic devices that match or surpass corresponding state-of-the-art device performances.