Encapsulation of vanillin/cyclodextrin ınclusion complexes in electrospun nanowebs: high-temperature stability and slow release of vanillin

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buir.contributor.orcidUyar, Tamer|0000-0002-3989-4481
dc.contributor.authorKayacı, Fatmaen_US
dc.contributor.authorUyar, Tameren_US
dc.coverage.spatialSt. Gallen, Switzerlanden_US
dc.date.accessioned2019-07-05T17:06:35Z
dc.date.available2019-07-05T17:06:35Z
dc.date.issued2012en_US
dc.departmentInstitute of Materials Science and Nanotechnology (UNAM)en_US
dc.descriptionDate of Conference: 23–25 May 2012en_US
dc.identifier.urihttp://hdl.handle.net/11693/52141
dc.language.isoEnglishen_US
dc.publisherThe Fiber Societyen_US
dc.source.titleThe Fiber Society 2012 Spring Conferenceen_US
dc.titleEncapsulation of vanillin/cyclodextrin ınclusion complexes in electrospun nanowebs: high-temperature stability and slow release of vanillinen_US
dc.typeConference Paperen_US
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