High performance 3D CMP design with stacked hybrid memory architecture in the dark silicon era using a convex optimization model
Date
2016-05Source Title
Proceedings - IEEE International Symposium on Circuits and Systems, 2016
Publisher
IEEE
Pages
2607 - 2610
Language
English
Type
Conference PaperItem Usage Stats
223
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252
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Abstract
In this article, we present a convex optimization model to design a stacked hybrid memory system to improve performance and reduce energy consumption of the chip-multiprocessor (CMP). Our convex model optimizes numbers and placement of SRAM and STT-RAM memories on the memory layer, and efficiently maps applications/threads on cores in the core layer. Power consumption that is the main challenge in the dark silicon era is represented as a power constraint in this work and it is satisfied by the detailed optimization model in order to design a dark silicon aware 3D CMP. Experimental results show that the proposed architecture considerably improves the energy-delay product (EDP) and performance of the 3D CMP compared to the Baseline memory design. © 2016 IEEE.
Keywords
Convex-optimizationDark silicon
Embedded chip-multiprocessor (eCMP)
Hybrid memory architecture
Non-volatile memory (NVM)
Power management
Convex optimization
Data storage equipment
Design
Digital storage
Energy utilization
Multiprocessing systems
Optimization
Power management
Product design
Random access storage
Reconfigurable hardware
Silicon
Static random access storage
Chip multiprocessors
Dark silicons
Embedded chips
Energy delay product
Non-volatile memory
Optimization modeling
Proposed architectures
Reduce energy consumption
Memory architecture
Permalink
http://hdl.handle.net/11693/37724Published Version (Please cite this version)
http://dx.doi.org/10.1109/ISCAS.2016.7539127Collections
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