High performance 3D CMP design with stacked hybrid memory architecture in the dark silicon era using a convex optimization model
Proceedings - IEEE International Symposium on Circuits and Systems, 2016
2607 - 2610
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In this article, we present a convex optimization model to design a stacked hybrid memory system to improve performance and reduce energy consumption of the chip-multiprocessor (CMP). Our convex model optimizes numbers and placement of SRAM and STT-RAM memories on the memory layer, and efficiently maps applications/threads on cores in the core layer. Power consumption that is the main challenge in the dark silicon era is represented as a power constraint in this work and it is satisfied by the detailed optimization model in order to design a dark silicon aware 3D CMP. Experimental results show that the proposed architecture considerably improves the energy-delay product (EDP) and performance of the 3D CMP compared to the Baseline memory design. © 2016 IEEE.
Embedded chip-multiprocessor (eCMP)
Hybrid memory architecture
Non-volatile memory (NVM)
Data storage equipment
Random access storage
Static random access storage
Energy delay product
Reduce energy consumption
Published Version (Please cite this version)http://dx.doi.org/10.1109/ISCAS.2016.7539127
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Ozturk, O.; Kandemir, M.; Irwin, M. J. (Institute of Electrical and Electronics Engineers, 2009-06)The memory system presents one of the critical challenges in embedded system design and optimization. This is mainly due to the ever-increasing code complexity of embedded applications and the exponential increase seen in ...
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