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dc.contributor.authorOliaei, Samad Nadimi Bavilen_US
dc.contributor.authorKarpat, Yiğiten_US
dc.coverage.spatialTokyo, Japanen_US
dc.date.accessioned2018-04-12T11:41:59Zen_US
dc.date.available2018-04-12T11:41:59Zen_US
dc.date.issued2016en_US
dc.identifier.issn2212-8271en_US
dc.identifier.urihttp://hdl.handle.net/11693/37495en_US
dc.descriptionDate of Conference: 18-22 April 2016en_US
dc.descriptionConference Name: 18th CIRP Conference on Electro Physical and Chemical Machining (ISEM XVIII), 2016en_US
dc.description.abstractFabrication of micro components made from difficult-to-cut materials require the use of micro cutting tools which can withstand the harsh conditions during machining. Polycrystalline diamond micro tools, produced using micro wire electro discharge machining, have been used to machine silicon. In this study, fabrication of PCD planarization tools having micro-pyramid lattice structure is considered. A tungsten wire with 30 μm diameter was used, which makes it possible to obtain very precise micro-features by employing extremely low discharge energies. The performance of the tools is investigated through micro scale grinding of silicon and appropriate machining parameters which resulted in ductile regime machining of silicon are determined.en_US
dc.language.isoEnglishen_US
dc.source.titleProceedings of the 18th CIRP Conference on Electro Physical and Chemical Machining (ISEM XVIII), 2016en_US
dc.relation.isversionofhttp://dx.doi.org/10.1016/j.procir.2016.02.291en_US
dc.subjectDuctile mode machiningen_US
dc.subjectElectrical discharge machiningen_US
dc.subjectMicro cutting toolen_US
dc.subjectMicro grindingen_US
dc.subjectPolycrystalline diamonden_US
dc.titleFabrication of PCD mechanical planarization tools by using μ-wire electrical discharge machiningen_US
dc.typeConference Paperen_US
dc.departmentDepartment of Mechanical Engineeringen_US
dc.departmentDepartment of Industrial Engineeringen_US
dc.citation.spage311en_US
dc.citation.epage316en_US
dc.citation.volumeNumber42en_US
dc.identifier.doi10.1016/j.procir.2016.02.291en_US
dc.publisherElsevieren_US


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