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dc.contributor.authorKerse, Canen_US
dc.contributor.authorKalaycıoğlu, Hamiten_US
dc.contributor.authorAkaalan O.en_US
dc.contributor.authorEldeniz, Y.B.en_US
dc.contributor.authorİlday, F. Ömeren_US
dc.contributor.authorHoogland H.en_US
dc.contributor.authorHolzwarth, R.en_US
dc.coverage.spatialMunich, Germanyen_US
dc.date.accessioned2016-02-08T12:09:36Z
dc.date.available2016-02-08T12:09:36Z
dc.date.issued2013en_US
dc.identifier.urihttp://hdl.handle.net/11693/28047
dc.descriptionDate of Conference: 12-16 May 2013en_US
dc.description.abstractThere are a number of applications that would avail a pulse pattern in the form of closely grouped and uniformly spaced pulses, i.e., bursts [1]. Closely grouped pulses with pulse to pulse separation in the order of a few nanoseconds have a potential for increasing material removal rates [2] and thereby reducing the thermal effects. Besides, keeping the burst repetition period in the order of thermal relaxation time has the advantage of keeping the overall average power at lower levels in order to prevent the cumulative heating of the material. © 2013 IEEE.en_US
dc.language.isoEnglishen_US
dc.source.title2013 Conference on Lasers & Electro-Optics Europe & International Quantum Electronics Conference CLEO EUROPE/IQECen_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/CLEOE-IQEC.2013.6801593en_US
dc.subjectQuantum electronicsen_US
dc.subjectRelaxation timeen_US
dc.subjectAverage poweren_US
dc.subjectMaterial removal rateen_US
dc.subjectNonthermalen_US
dc.subjectPulse patternen_US
dc.subjectPulse separationsen_US
dc.subjectRepetition rateen_US
dc.subjectThermal relaxation timeen_US
dc.subjectTissue processingen_US
dc.subjectElectron opticsen_US
dc.titleNon-thermal material and tissue processing with 100 MHz and 500 MHz repetition rate burstsen_US
dc.typeConference Paperen_US
dc.departmentDepartment of Electrical and Electronics Engineering
dc.departmentDepartment of Physics
dc.departmentDepartment of Electrical and Electronics Engineering
dc.identifier.doi10.1109/CLEOE-IQEC.2013.6801593en_US
dc.publisherIEEEen_US


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