Reliability-aware heterogeneous 3D chip multiprocessor design
Journal of Electronic Testing: theory and applications
177 - 184
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Ability to stack separate chips in a single package enables three-dimensional integrated circuits (3D ICs). Heterogeneous 3D ICs provide even better opportunities to reduce the power and increase the performance per unit area. An important issue in designing a heterogeneous 3D IC is reliability. To achieve this, one needs to select the data mapping and processor layout carefully. This paper addresses this problem using an integer linear programming (ILP) approach. Specifically, on a heterogeneous 3D CMP, it explores how applications can be mapped onto 3D ICs to maximize reliability. Preliminary experiments indicate that the proposed technique generates promising results in both reliability and performance. © 2013 Springer Science+Business Media New York.