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dc.contributor.authorNosich, A.I.en_US
dc.contributor.authorShapoval O.V.en_US
dc.contributor.authorSukharevsky I.O.en_US
dc.contributor.authorAltintas, A.en_US
dc.date.accessioned2016-02-08T11:35:47Z
dc.date.available2016-02-08T11:35:47Z
dc.date.issued2014en_US
dc.identifier.urihttp://hdl.handle.net/11693/26786
dc.description.abstractThe two-dimensional (2D) scattering of the E and H-polarized plane electromagnetic waves by a free-standing thinner than the wavelength dielectric strip is considered numerically. Two methods are compared: singular integral equations (SIE) on the strip median line obtained from the generalized boundary conditions for a thin dielectric layer and Muller boundary integral equations (BIE) for arbitrarily thick strip. The comparison shows the domain of acceptable accuracy of approximate model derived for thin dielectric strips. © 2014 IEEE.en_US
dc.language.isoEnglishen_US
dc.source.title2014 International Conference on Numerical Electromagnetic Modeling and Optimization for RF, Microwave, and Terahertz Applications, NEMO 2014en_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/NEMO.2014.6995684en_US
dc.subjectGeneralized boundary conditionsen_US
dc.subjectIntegral equationsen_US
dc.subjectScatteringen_US
dc.subjectThin stripen_US
dc.subjectBoundary conditionsen_US
dc.subjectBoundary integral equationsen_US
dc.subjectComputational electromagneticsen_US
dc.subjectElectromagnetic wave polarizationen_US
dc.subjectElectromagnetic wavesen_US
dc.subjectScatteringen_US
dc.subjectApproximate modelen_US
dc.subjectDielectric stripsen_US
dc.subjectGeneralized boundary conditionsen_US
dc.subjectMuller boundary integral equationsen_US
dc.subjectSingular integral equationsen_US
dc.subjectThin dielectric layeren_US
dc.subjectThin stripsen_US
dc.subjectTwo Dimensional (2 D)en_US
dc.subjectIntegral equationsen_US
dc.titleTest of accuracy of the generalized boundary conditions in the scattering by thin dielectric stripsen_US
dc.typeConference Paperen_US
dc.departmentDepartment of Electrical and Electronics Engineering
dc.identifier.doi10.1109/NEMO.2014.6995684en_US
dc.publisherInstitute of Electrical and Electronics Engineers Inc.en_US


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