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dc.contributor.authorLu, S.en_US
dc.contributor.authorLiu W.en_US
dc.contributor.authorZhang, Z.-H.en_US
dc.contributor.authorTan, S.T.en_US
dc.contributor.authorJu, Z.en_US
dc.contributor.authorJi, Y.en_US
dc.contributor.authorZhang X.en_US
dc.contributor.authorZhang, Y.en_US
dc.contributor.authorZhu, B.en_US
dc.contributor.authorKyaw, Z.en_US
dc.contributor.authorHasanov, N.en_US
dc.contributor.authorSun X.W.en_US
dc.contributor.authorDemir, Hilmi Volkanen_US
dc.date.accessioned2016-02-08T11:02:28Z
dc.date.available2016-02-08T11:02:28Z
dc.date.issued2014en_US
dc.identifier.issn10944087
dc.identifier.urihttp://hdl.handle.net/11693/26620
dc.description.abstractIn this work, low thermal-mass LEDs (LTM-LEDs) were developed and demonstrated in flip-chip configuration, studying both experimentally and theoretically the enhanced electrical and optical characteristics and the limits. LTM-LED chips in 25 × 25 μm2, 50 × 50 μm2, 100 × 100 μm2 and 200 × 200 μm2 mesa sizes were fabricated and comparatively investigated. Here it was revealed that both the electrical and optical properties are improved by the decreasing chip size due to the reduced thermal mass. With a smaller chip size (from 200 μm to 50 μm), the device generally presents higher current density against the bias and higher power density against the current density. However, the 25 × 25 μm2 device behaves differently, limited by the fabrication margin limit of 10 μm. The underneath mechanisms of these observations are uncovered, and furthermore, based on the device model, it is proven that for a specific flip-chip fabrication process, the ideal size for LTM-LEDs with optimal power density performance can be identified. ©2014 Optical Society of Americaen_US
dc.language.isoEnglishen_US
dc.source.titleOptics Expressen_US
dc.relation.isversionofhttp://dx.doi.org/10.1364/OE.22.032200en_US
dc.subjectFabricationen_US
dc.subjectFlip chip devicesen_US
dc.subjectOptical propertiesen_US
dc.subjectDevice modelingen_US
dc.subjectElectrical and optical propertiesen_US
dc.subjectFlip-chip configurationsen_US
dc.subjectOptical characteristicsen_US
dc.subjectOptimal poweren_US
dc.subjectPower densitiesen_US
dc.subjectSize effectsen_US
dc.subjectThermal massen_US
dc.subjectLight emitting diodesen_US
dc.subjectdevice failure analysisen_US
dc.subjectdevicesen_US
dc.subjectelectronicsen_US
dc.subjectenergy transferen_US
dc.subjectequipment designen_US
dc.subjectheaten_US
dc.subjectilluminationen_US
dc.subjectsemiconductoren_US
dc.subjecttemperatureen_US
dc.subjectEnergy Transferen_US
dc.subjectEquipment Designen_US
dc.subjectEquipment Failure Analysisen_US
dc.subjectHot Temperatureen_US
dc.subjectLightingen_US
dc.subjectMiniaturizationen_US
dc.subjectSemiconductorsen_US
dc.subjectTemperatureen_US
dc.titleLow thermal-mass LEDs: Size effect and limitsen_US
dc.typeArticleen_US
dc.departmentDepartment of Electrical and Electronics Engineeringen_US
dc.citation.spage32200en_US
dc.citation.epage32207en_US
dc.citation.volumeNumber22en_US
dc.citation.issueNumber26en_US
dc.identifier.doi10.1364/OE.22.032200en_US
dc.publisherOptical Society of American (OSA)en_US
dc.contributor.bilkentauthorDemir, Hilmi Volkan


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