Low thermal-mass LEDs: Size effect and limits
Author(s)
Date
2014Source Title
Optics Express
Print ISSN
10944087
Publisher
Optical Society of American (OSA)
Volume
22
Issue
26
Pages
32200 - 32207
Language
English
Type
ArticleItem Usage Stats
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Abstract
In this work, low thermal-mass LEDs (LTM-LEDs) were developed and demonstrated in flip-chip configuration, studying both experimentally and theoretically the enhanced electrical and optical characteristics and the limits. LTM-LED chips in 25 × 25 μm2, 50 × 50 μm2, 100 × 100 μm2 and 200 × 200 μm2 mesa sizes were fabricated and comparatively investigated. Here it was revealed that both the electrical and optical properties are improved by the decreasing chip size due to the reduced thermal mass. With a smaller chip size (from 200 μm to 50 μm), the device generally presents higher current density against the bias and higher power density against the current density. However, the 25 × 25 μm2 device behaves differently, limited by the fabrication margin limit of 10 μm. The underneath mechanisms of these observations are uncovered, and furthermore, based on the device model, it is proven that for a specific flip-chip fabrication process, the ideal size for LTM-LEDs with optimal power density performance can be identified. ©2014 Optical Society of America
Keywords
FabricationFlip chip devices
Optical properties
Device modeling
Electrical and optical properties
Flip-chip configurations
Optical characteristics
Optimal power
Power densities
Size effects
Thermal mass
Light emitting diodes
device failure analysis
devices
electronics
energy transfer
equipment design
heat
illumination
semiconductor
temperature
Energy Transfer
Equipment Design
Equipment Failure Analysis
Hot Temperature
Lighting
Miniaturization
Semiconductors
Temperature