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dc.contributor.authorÜnlügedik, A.en_US
dc.contributor.authorTaşdelen, A.en_US
dc.contributor.authorAtalar, Abdullahen_US
dc.contributor.authorKöymen, H.en_US
dc.date.accessioned2016-02-08T10:39:12Z
dc.date.available2016-02-08T10:39:12Z
dc.date.issued2014en_US
dc.identifier.issn0885-3010
dc.identifier.urihttp://hdl.handle.net/11693/25102
dc.description.abstractWe report a new mode of airborne operation for capacitive micromachined ultrasonic transducers (CMUT), in which the plate motion spans the entire gap without collapsing and the transducer is driven by a sinusoidal voltage without a dc bias. We present equivalent-circuit-based design fundamentals for an airborne CMUT cell and verify the design targets using fabricated CMUTs. The performance limits for silicon plates are derived. We experimentally obtain 78.9 dB//20 μPa@1 m source level at 73.7 kHz, with a CMUT cell of radius 2.05 mm driven by 71 V sinusoidal drive voltage at half the frequency. The measured quality factor is 120. We also study and discuss the interaction of the nonlinear transduction force and the nonlinearity of the plate compliance. © 1986-2012 IEEE.en_US
dc.language.isoEnglishen_US
dc.source.titleIEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Controlen_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/TUFFC.2014.006457en_US
dc.subjectTransducersen_US
dc.subjectAirborne applicationsen_US
dc.subjectCapacitive micromachined ultrasonic transduceren_US
dc.subjectNonlinear transductionen_US
dc.subjectPerformance limitsen_US
dc.subjectQuality factorsen_US
dc.subjectSilicon platesen_US
dc.subjectSinusoidal voltageen_US
dc.subjectSinusoidal-drive voltageen_US
dc.subjectUltrasonic transducersen_US
dc.titleDesigning transmitting CMUT cells for airborne applicationsen_US
dc.typeArticleen_US
dc.departmentDepartment of Electrical and Electronics Engineeringen_US
dc.departmentAcoustics and Underwater Technologies Research Centeren_US
dc.citation.spage1899en_US
dc.citation.epage1910en_US
dc.citation.volumeNumber61en_US
dc.citation.issueNumber11en_US
dc.identifier.doi10.1109/TUFFC.2014.006457en_US
dc.publisherInstitute of Electrical and Electronics Engineers Inc.en_US


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