Study of the power performance of gaN based HEMTs with varying field plate lengths
International Journal of Circuits, Systems and Signal Processing
North Atlantic University Union
174 - 179
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In this paper, we report the optimum power performance of GaN based high-electron-mobility-transistors (HEMTs) on SiC substrate with the field plates of various dimensions. The AlGaN/GaN HEMTs are fabricated with 0.6 µm gate length, 3 µm drain-source space. And also, the field plate structures with the lengths of 0.2, 0.3, 0.5, and 0.7 µm have been fabricated on these HEMTs. Great enhancement in radio frequency (RF) output power density was achieved with acceptable compromise in small signal gain. A HEMT of 0.5 µm field plate length and 800 µm gate width is biased under 35 V, at 3 dB gain compression, The results showed that we obtained a continuous wave output power of 36.2 dBm (5.2 W/mm), power-added efficiency (PAE) of 33% and a small signal gain of 11.4 dB from this device. We also could achieve a continuous wave output power of 37.2 dBm (5.2 W/mm), poweradded efficiency (PAE) of 33.7% and a small gain of 10.7 dB from another HEMT with 0.5 µm field plate length and 1000 µm gate width. These results were obtained at 8 GHz without using a via hole technology. The results seem very stunning in this respect. © 2015, North Atlantic University Union. All rights reserved.
RF power applications
Field effect transistors
Plates (structural components)
Radio frequency amplifiers
Continuous wave output power
High electron mobility transistor (HEMTs)
Output power density
RF power applications
High electron mobility transistors
Showing items related by title, author, creator and subject.
Toprak, Ahmet; Kurt, Gökhan; Şen, Özlem A.; Özbay, Ekmel (IEEE, 2014)In this work, we report GaN high-electron-mobility-transistors (HEMTs) on SiC with field plates of various dimensions for optimum performance. 0.6 μm gate length, 3 μm drain source space AlGaN/GaN HEMTs with field-plate ...
Gürdal, Armağan; Özipek, Ulaş; Sütbaş, Batuhan; Özbay, Ekmel (IEEE, 2019)An X-band microstrip power amplifier MMIC based on our 0.25 μm AlGaN/GaN on SiC process technology is presented in this work. Fabrication steps, HEMT structure and typical device performance are demonstrated. Design procedure ...
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