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dc.contributor.authorGurbuz, A. C.en_US
dc.contributor.authorTeke, O.en_US
dc.contributor.authorArikan, O.en_US
dc.date.accessioned2016-02-08T09:39:48Z
dc.date.available2016-02-08T09:39:48Z
dc.date.issued2013en_US
dc.identifier.issn1017-9909
dc.identifier.urihttp://hdl.handle.net/11693/21023
dc.description.abstractSpatial sparsity of the target space in subsurface or through-the-wall imaging applications has been successfully used within the compressive-sensing framework to decrease the data acquisition load in practical systems, while also generating highresolution images. The developed techniques in this area mainly discretize the continuous target space into grid points and generate a dictionary of model data that is used in image-reconstructing optimization problems. However, for targets that do not coincide with the computation grid, imaging performance degrades considerably. This phenomenon is known as the off-grid problem. This paper presents a novel sparse ground-penetrating radar imaging method that is robust for off-grid targets. The proposed technique is an iterative orthogonal matching pursuit-based method that uses gradientbased steepest ascent-type iterations to locate the off-grid target. Simulations show that robust results with much smaller reconstruction errors are obtained for multiple off-grid targets compared to standard sparse reconstruction techniques. © 2013 SPIE and IS&T.en_US
dc.language.isoEnglishen_US
dc.source.titleJournal of Electronic Imagingen_US
dc.relation.isversionofhttp://dx.doi.org/10.1117/1.JEI.22.2.021007en_US
dc.subjectGround Penetrating Radaren_US
dc.subjectHigh resolution imageen_US
dc.subjectImaging performanceen_US
dc.subjectOptimization problemsen_US
dc.subjectPractical systemsen_US
dc.subjectReconstruction erroren_US
dc.subjectSparse reconstructionen_US
dc.subjectThrough the wall imagingen_US
dc.subjectGeological surveysen_US
dc.subjectRadar imagingen_US
dc.subjectIterative methodsen_US
dc.titleSparse ground-penetrating radar imaging method for off-the-grid target problemen_US
dc.typeArticleen_US
dc.departmentDepartment of Electrical and Electronics Engineeringen_US
dc.citation.volumeNumber22en_US
dc.citation.issueNumber2en_US
dc.identifier.doi10.1117/1.JEI.22.2.021007en_US
dc.publisherSPIEen_US


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