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dc.contributor.authorKurudere, S.en_US
dc.contributor.authorErturk, V. B.en_US
dc.date.accessioned2016-02-08T09:34:38Z
dc.date.available2016-02-08T09:34:38Z
dc.date.issued2013en_US
dc.identifier.issn1531-1309
dc.identifier.urihttp://hdl.handle.net/11693/20757
dc.description.abstractA novel configuration for mechanically tunable combline bandpass filters is proposed, where the classical resonating rod-tuning screw combination is replaced with a simple printed circuit-tuning screw combination. Moreover, because a printed circuit structure that uses metal vias forms the bottom part of the cavity, the coaxial type feeding and the coaxial to cavity matching of classical combline filters are also replaced with a microstrip feeding. Consequently, the proposed configuration provides smaller size, less weight, integration with other printed circuits and significant simplification in the fabrication process. A prototype filter is designed and fabricated for verification. The measured results are in good agreement with the simulation, and the filter exhibits very good harmonic suppression.en_US
dc.language.isoEnglishen_US
dc.source.titleIEEE Microwave and Wireless Components Lettersen_US
dc.relation.isversionofhttp://dx.doi.org/10.1109/LMWC.2013.2281432en_US
dc.subjectHarmonic suppressionen_US
dc.subjecttunable combline filters (TCFs)en_US
dc.subjectCavity filtersen_US
dc.subjectCircuit structuresen_US
dc.subjectCombline bandpass filteren_US
dc.subjectCombline filtersen_US
dc.subjectFabrication processen_US
dc.subjectHarmonic suppressionen_US
dc.subjectMeasured resultsen_US
dc.subjectPrototype filtersen_US
dc.subjectBandpass filtersen_US
dc.subjectHarmonic analysisen_US
dc.subjectScrewsen_US
dc.subjectPrinted circuitsen_US
dc.titleNovel microstrip fed mechanically tunable combline cavity filteren_US
dc.typeArticleen_US
dc.departmentDepartment of Electrical and Electronics Engineeringen_US
dc.citation.spage578en_US
dc.citation.epage580en_US
dc.citation.volumeNumber23en_US
dc.citation.issueNumber11en_US
dc.identifier.doi10.1109/LMWC.2013.2281432en_US
dc.publisherIEEEen_US


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