Metal coverage on single-wall carbon nanotubes : metal nanoring and nanotube formation
Bağcı, V M Kemal
Item Usage Stats
MetadataShow full item record
The carbon nanotubes are welcomed as the basis element for electronic and opto-electronic devices of nanometers size, the size of a few atoms. The question of crucial importance in the physics of utilization of nanotubes as nanowires, transistors, couplers etc. is the metal-nanotube interactions. In this thesis, we considered the problem of metal coverage of nanotubes and single atom-metal interactions, using the first-principles computational techniques. We had found that Ti, Fe and Ni bind strongly to the nanotube while Al, Cu and Au has weak binding. We propose that d orbital electrons of transition metal elements play important role in the strong interactions. We also observed that strong metalmetal interaction prevents uniform coverage of nanotube, however a stable ring and tube of aluminum atoms with well defined patterns can also form around the semiconducting SWNT’s and lead to metallization. We have obtained a criteria for the uniform coverage of nanotubes by metal atoms.
ab-initio electronic structure
Showing items related by title, author, creator and subject.
Large area compatible broadband superabsorber surfaces in the VIS-NIR spectrum utilizing metal-insulator-metal stack and plasmonic nanoparticles Dereshgi, S. A.; Okyay, A. K. (OSA - The Optical Society, 2016)Plasmonically enhanced absorbing structures have been emerging as strong candidates for photovoltaic (PV) devices. We investigate metal-insulator-metal (MIM) structures that are suitable for tuning spectral absorption ...
Eryilmaz, S. B.; Tidin, O.; Okyay, A., K. (Institute of Electrical and Electronics Engineers, 2012-01-09)Metallic nanoslit arrays integrated on germanium metal-semiconductor-metal photodetectors show many folds of absorption enhancement for transverse-magnetic polarization in the telecommunication C-band. Such high enhancement ...
Onbasli, M.C.; Okyay, A., K. (SPIE, 2010)State-of-the-art copper interconnects suffer from increasing spatial power dissipation due to chip downscaling and RC delays reducing operation bandwidth. Wide bandwidth, minimized Ohmic loss, deep sub-wavelength confinement ...